Advanced Packaging Substrate Supplier Enablement Lead

Intel
Phoenix
Workplace: OnsiteFull timeUSD 164,100 - 231,670 annuallyFunction: Administration & Executive AssistanceExperience: 9+ yearsSkills: ["Structured problem solving","Data-driven decision-making","Supplier management","Cross-functional collaboration","Communication"]

Lead advanced packaging substrate supplier development and qualification to enable new manufacturing capacity. Own process integration roadmaps, establish manufacturing procedures for technology transfer milestones, and manage readiness activities with supplier partners and cross-functional engineering teams. Apply data-driven methods for yield improvement, lead low-yield root-cause and corrective actions, and assess quality/reliability risks for material and process changes to sustain product performance.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Intel
Intel
5 days ago

Advanced Packaging Substrate Supplier Enablement Lead

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 5 hours agoStatus: Live
Reposted: similar role first listed 6 months ago

Job Summary

Lead advanced packaging substrate supplier development and qualification to enable new manufacturing capacity. Own process integration roadmaps, establish manufacturing procedures for technology transfer milestones, and manage readiness activities with supplier partners and cross-functional engineering teams. Apply data-driven methods for yield improvement, lead low-yield root-cause and corrective actions, and assess quality/reliability risks for material and process changes to sustain product performance.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Mid level

Key Responsibilities

  • •Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones.
  • •Extract insights from structured and unstructured data and apply statistical analysis and coding techniques for yield improvement.
  • •Lead low yield analysis and corrective actions to address quality excursions in high-volume production.
  • •Drive continuous improvement initiatives to minimize defects and optimize process reliability.
  • •Assess quality and reliability risks for manufacturing material and process changes and collaborate with internal and external stakeholders.
Travel: Low travel

Pay and Benefits

Salary: USD 164,100 - 231,670 annually
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor’s degree in engineering, physics, materials science, or related field with 9+ years of relevant experience; or Master’s with 6+ years; or PhD with 4+ years.
  • •Proficiency in process integration methodologies and tools used in semiconductor manufacturing environments.
  • •Experience in advanced packaging, substrates, or semiconductor process development.
  • •Demonstrated expertise in structured problem solving and data-driven decision-making.
  • •Proven leadership in supplier management and technology enablement.
Experience:9+ yearsSemiconductor manufacturingAdvanced packagingSupplier developmentWafer assembly
Education:
Skills:Structured problem solvingData-driven decision-makingSupplier managementCross-functional collaborationCommunication

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
WebsiteLinkedInGlassdoor