Principal/Staff Engineer, PCVD Film Deposition, TD

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 5+ yearsSkills: ["Root-cause analysis","Data analytics","Problem-solving","Technical leadership","Mentoring"]

Develop and optimize advanced thin-film deposition processes for next-generation memory technologies, spanning ALD, LPCVD, PECVD, and PVD. Execute complex DOE experiments to improve process capability, uniformity, and reliability, and perform root-cause analysis using modeling and characterization. Partner across integration, metrology, equipment, and other process areas to solve technical challenges, define technology roadmaps, and mentor engineers while driving innovation in performance, cost, and sustainability.

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Micron Technology
Micron Technology
7 months ago

Principal/Staff Engineer, PCVD Film Deposition, TD

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Last checked: 6 hours agoStatus: Live

Job Summary

Develop and optimize advanced thin-film deposition processes for next-generation memory technologies, spanning ALD, LPCVD, PECVD, and PVD. Execute complex DOE experiments to improve process capability, uniformity, and reliability, and perform root-cause analysis using modeling and characterization. Partner across integration, metrology, equipment, and other process areas to solve technical challenges, define technology roadmaps, and mentor engineers while driving innovation in performance, cost, and sustainability.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize advanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) for next-generation device architectures.
  • •Design and execute complex DOE experiments to improve process capability, uniformity, and reliability.
  • •Conduct in-depth root-cause analysis using advanced modeling and characterization techniques.
  • •Collaborate with integration, metrology, and equipment engineering teams to resolve critical technical challenges.
  • •Define technology roadmaps and lead strategic research initiatives, including mentoring junior engineers and driving IP creation.

Key Requirements

  • •Ph.D. or Master’s in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related fields.
  • •Master’s with at least 8 years, or Ph.D. with at least 5 years, of hands-on experience in advanced thin film deposition, characterization, or related semiconductor work.
  • •Strong expertise in ALD, LPCVD, PECVD, and PVD for advanced nodes.
  • •Proficiency in DOE, SPC, and advanced statistical analysis, with familiarity with TCAD or process simulation tools for film modeling.
  • •Hands-on thin film characterization experience (e.g., TEM, SEM, XPS, SIMS, XRD, AFM, ellipsometry) plus advanced root-cause analysis capability.
Experience:5+ yearsSemiconductorThin film depositionMemory technologiesProcess development
Education:
Skills:Root-cause analysisData analyticsProblem-solvingTechnical leadershipMentoring
Tech Stack:ALDLPCVDPECVDPVDDOESPCTCADProcess simulationData analyticsMachine learningTEMSEMXPSSIMSXRDAFMEllipsometryPlasma physicsFilm growth mechanismsSurface chemistry

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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