2027校招-封装工程师/Packaging Engineer

Texas Instruments
Chengdu
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringEducation: bachelorsSkills: ["Analytical problem-solving","Communication","Team collaboration","Time management","Initiative"]

Design and develop semiconductor packaging technologies that improve miniaturization, integration, reliability, performance, and low power for TI’s analog and embedded processing products. Partner with internal teams and suppliers to support packaging qualification and production, meet reliability and yield targets, and ensure design testability and coverage. Use design-of-experiments, downselect materials, and build electrical, mechanical, and thermal models to establish rules and reduce high-risk designs.

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FursaFursa
Texas Instruments
Texas Instruments
1 month ago

2027校招-封装工程师/Packaging Engineer

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Job Summary

Design and develop semiconductor packaging technologies that improve miniaturization, integration, reliability, performance, and low power for TI’s analog and embedded processing products. Partner with internal teams and suppliers to support packaging qualification and production, meet reliability and yield targets, and ensure design testability and coverage. Use design-of-experiments, downselect materials, and build electrical, mechanical, and thermal models to establish rules and reduce high-risk designs.
Location: Chengdu
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Graduate level

Key Responsibilities

  • •Partner with the business to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs, and advanced packages.
  • •Work on cross-functional teams to support product qualification and production, meeting reliability and yield requirements and improving design testability and test coverage.
  • •Lead design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance reliability and performance.
  • •Conduct electrical, mechanical, and thermal modeling to understand silicon-to-package interaction, establish design rules, and predict/prevent high-risk designs.

Key Requirements

  • •Bachelor’s degree in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science or Physics, or Electrical Engineering.
  • •Cumulative 3.0/4.0 GPA or higher.
  • •Basic understanding of statistical process control (SPC).
  • •Semiconductor packaging knowledge (manufacturing processes, assembly, reliability, materials, characterization, FA).
  • •Demonstrated analytical and problem-solving skills with strong written and verbal communication.
Experience:Semiconductor packaging
Education:Bachelor's in Material Science, Mechanical Engineering, Chemical Engineering, Polymer Science, Physics, or Electrical Engineering
Skills:Analytical problem-solvingCommunicationTeam collaborationTime managementInitiative
Tech Stack:WirebondFlip ChipModulesSIPsStatistical process control (SPC)

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

Texas Instruments
Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Dallas, United States
Founded: 1930
WebsiteLinkedIn