2027校招-封装工程师/Packaging Engineer

Design and develop semiconductor packaging technologies that improve miniaturization, integration, reliability, performance, and low power for TI’s analog and embedded processing products. Partner with internal teams and suppliers to support packaging qualification and production, meet reliability and yield targets, and ensure design testability and coverage. Use design-of-experiments, downselect materials, and build electrical, mechanical, and thermal models to establish rules and reduce high-risk designs.