Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 5+ yearsEducation: mastersSkills: ["Problem-solving","Root cause analysis","Collaboration","Communication","Accountability"]

Drive package and HBM product engineering activities within the HIG HBM Product Engineering team. Own yield improvement efforts across assembly-related coverage, HBM cube yield, and cumulative yield for quality, cost, cycle time, and scale. Lead root-cause analysis for packaging issues using EFA/PFA, coordinate backend process conversions with cross-functional teams, and help deploy AI/ML models to improve key KPIs, while supporting project execution and technical prioritization.

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FursaFursa
Micron Technology
Micron Technology
4 weeks ago

Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Drive package and HBM product engineering activities within the HIG HBM Product Engineering team. Own yield improvement efforts across assembly-related coverage, HBM cube yield, and cumulative yield for quality, cost, cycle time, and scale. Lead root-cause analysis for packaging issues using EFA/PFA, coordinate backend process conversions with cross-functional teams, and help deploy AI/ML models to improve key KPIs, while supporting project execution and technical prioritization.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Own assembly-related yield improvement, reducing inline fallout and improving Time 0 and Field DPM.
  • •Improve HBM cube yield via test optimization and coverage, partnering with technology and packaging organizations.
  • •Lead cumulative yield ownership and quality improvement initiatives with cross-functional teams.
  • •Debug and resolve packaging quality/RMA issues using electric failure analysis (EFA) and physical failure analysis (PFA).
  • •Collaborate on backend process conversions and AI/ML model efforts to enhance yield, reliability, and performance; support project prioritization and technical decision-making.

Key Requirements

  • •Bachelors/Masters in Electrical/Electronic/Mechanical Engineering with 5+ years of experience in the semiconductor industry.
  • •Demonstrated technical skills in root-cause problem solving and circuit analysis.
  • •Knowledge of statistics and data analysis tools, including scripting.
  • •Experience handling test flows and/or assembly process and advanced packaging (added advantage).
  • •Experience with AI/ML work for efficiency improvement and strong collaboration, communication, and accountability.
Experience:5+ yearsSemiconductorPackagingHBMManufacturing
Education:Master's in Electrical/Electronic/Mechanical Engineering
Skills:Problem-solvingRoot cause analysisCollaborationCommunicationAccountability
Tech Stack:EFAPFAAI/MLStatisticsData analysisScripting

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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