Senior Advanced Packaging Defect Inspection Engineer

Intel
United States
Workplace: OnsiteFull timeUSD 115,110 - 219,550 annuallyFunction: Solutions Engineering & Sales EngineeringExperience: 4+ yearsEducation: bachelorsSkills: ["Technical problem-solving","Cross-functional collaboration","Data-driven decision-making","Strategic planning","Influence with partners"]

Own end-to-end qualification of advanced packaging metrology and inspection equipment, from installation and acceptance testing through process validation and full fab readiness. Lead the development of sophisticated metrology/inspection processes (material selection, parameter optimization, equipment configuration) and drive long-range technology roadmaps informed by semiconductor metrology trends. Serve as the primary technical resource for fab support, improving tool fleet performance and resolving metrology-related program risks through data-driven feedback and collaboration with AI/automation teams.

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FursaFursa
Intel
Intel
3 days ago

Senior Advanced Packaging Defect Inspection Engineer

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Last checked: 8 hours agoStatus: Live

Job Summary

Own end-to-end qualification of advanced packaging metrology and inspection equipment, from installation and acceptance testing through process validation and full fab readiness. Lead the development of sophisticated metrology/inspection processes (material selection, parameter optimization, equipment configuration) and drive long-range technology roadmaps informed by semiconductor metrology trends. Serve as the primary technical resource for fab support, improving tool fleet performance and resolving metrology-related program risks through data-driven feedback and collaboration with AI/automation teams.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Drive technology development and enablement for high-volume manufacturing and future technology nodes through process integration and equipment solutions.
  • •Lead design and development of metrology/inspection processes, including material selection, parameter optimization, equipment configuration, and system design.
  • •Define and own the metrology group’s long-range technology roadmap, translating industry trends and program requirements into a prioritized strategy.
  • •Qualify next-generation metrology and inspection equipment end-to-end, from installation and acceptance testing through process validation and fab readiness.
  • •Serve as a primary technical resource for fab support by resolving metrology-related program holds, providing engineering disposition on excursions, and maintaining tool fleet performance and availability.

Pay and Benefits

Salary: USD 115,110 - 219,550 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid LeaveEquity

Key Requirements

  • •Bachelor’s degree in a STEM field (materials science, EE, ME, chemical engineering, physics, chemistry, or related) with 4+ years of relevant experience; or master’s with 2+ years; or PhD.
  • •Relevant experience in semiconductor processing, wafer-level assembly, or cleanroom environments.
  • •Proficiency in process development methodologies, statistical process control (SPC), and manufacturing process improvement.
  • •Technical expertise in module engineering or fab process/hardware technology development.
  • •Preferred: strong metrology fundamentals and development experience, plus collaboration across yield and operations.
Experience:4+ yearsSemiconductor processingMetrologyAdvanced packagingManufacturingCleanroom
Education:Bachelor's in materials science, electrical engineering, mechanical engineering, chemical engineering, physics, chemistry, or related STEM field
Skills:Technical problem-solvingCross-functional collaborationData-driven decision-makingStrategic planningInfluence with partners
Tech Stack:PythonAIMachine learningStatistical process control (SPC)Data analysisDashboardsScripting

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
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