Silicon Photonics Packaging Technical Leader- (Hybrid)

Lead the development and qualification of advanced packaging solutions for next-generation optical transceiver products. Serve as the primary technical interface with outsourced semiconductor assembly and test (OSAT) partners, driving assembly, test, and qualification for silicon photonics. Own test-vehicle design and design reviews for complex substrates, while providing cross-functional technical leadership to mitigate risks, resolve complex assembly issues, and set quality and reliability standards across the supply chain.