Process Development Engineer | RF Photonics

Texas Instruments
Dallas
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 3+ yearsEducation: mastersSkills: ["Problem-solving","Independent work","Cross-functional collaboration","Communication","Promoting new ideas"]

Lead heterogeneous integration process development for non-Si modulator materials in high-volume silicon photonics. Own and optimize the die-to-wafer bonding and post-bond device processing module in the cleanroom, scaling from R&D prototypes to manufacturing. Partner across advanced process development, fab operations, chip design/test, and packaging to align with device performance, yield, cost, and reliability while developing controls, failure analysis, characterization, and documentation.

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FursaFursa
Texas Instruments
Texas Instruments
1 day ago

Process Development Engineer | RF Photonics

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Job Summary

Lead heterogeneous integration process development for non-Si modulator materials in high-volume silicon photonics. Own and optimize the die-to-wafer bonding and post-bond device processing module in the cleanroom, scaling from R&D prototypes to manufacturing. Partner across advanced process development, fab operations, chip design/test, and packaging to align with device performance, yield, cost, and reliability while developing controls, failure analysis, characterization, and documentation.
Location: Dallas
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Lead process development, execution, and optimization of volume die-to-wafer (D2W) bonding and post-bond processing for non-Si material chiplets.
  • •Own parts of the non-Si chiplet integration process module in the cleanroom, including dicing, grinding, die-to-wafer bonding, and waveguide etching.
  • •Scale heterogeneous integration processes from initial R&D/prototyping to high-volume manufacturing.
  • •Bridge fab operations, advanced process development, and Kilby R&D design teams to align HI processes with device performance and fab capabilities.
  • •Establish process controls, root-cause failure analysis, yield enhancement strategies, and develop/maintain process documentation and reporting.

Key Requirements

  • •Master’s/Ph.D. degree in Electrical Engineering, Physics, Applied Physics, or Material Science.
  • •3+ years of industry experience with integration processing steps for non-Si high-speed modulator materials on silicon photonics in a high-volume fab (e.g., die-to-wafer bonding, post-bond waveguide etching/processing, metallization, and surface preparation).
  • •Experience with material physics and process-related effects for materials such as Lithium Niobate, Lithium Tantalate, Barium Titanate, or Indium Phosphide.
  • •Track record delivering high-yield process modules for heterogeneous integration in high-volume manufacturing.
  • •Strong statistical process control (SPC), design of experiments (DOE), and process characterization/troubleshooting with Cpk optimization and metrology/inspection.
Experience:3+ yearsSilicon photonicsSemiconductorsHigh-volume manufacturingHeterogeneous integrationR&D
Education:Master's in Electrical Engineering, Physics, Applied Physics, or Material Science
Skills:Problem-solvingIndependent workCross-functional collaborationCommunicationPromoting new ideas
Tech Stack:SPCDOEJMPMatlabPython

Company Brief

Texas Instruments
Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Dallas, United States
Founded: 1930
WebsiteLinkedIn