Intel

4 weeks ago

Advanced Packaging Singulation Module Engineering Manager

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 59 minutes agoStatus: Live

Job Summary

Lead a manufacturing engineering team to support high-volume advanced packaging production. Drive continuous improvement, safety, quality, and cost, and oversee equipment modifications, process/hardware development, and technology transfer across sites to deliver innovative device architectures.

Location: Albuquerque

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Manager level

Key Responsibilities

•Lead a team of module engineers and manufacturing operations engineers to support high-volume manufacturing with robust and sustainable solutions.
•Provide clear direction and management for daily operations, including maintenance, process engineering prioritization, yield improvement, and efficiency enhancements.
•Drive continuous improvement in safety, quality, output, and cost while fostering a culture of productivity and innovation.
•Recommend and oversee the implementation of modifications to operating equipment to improve production efficiency, manufacturing techniques, and production output.
•Plan and direct activities for process and hardware development to enable the manufacturing of innovative device architectures.

Pay and Benefits

Salary: USD 140,830 - 198,820 annually

Equity and Bonus:Equity

Perks:Health InsuranceEquity

Key Requirements

•Bachelor's degree in engineering, materials science, physics, or a related technical field.
•6+ years of experience with a Bachelor's degree (4+ years with a Master’s or 2+ years with a PhD).
•Experience in process characterization and process improvement within a manufacturing environment.
•Knowledge of GMP and lean manufacturing principles.
•Experience leading engineering teams with a focus on innovation and operational excellence (preferred).

Experience:6+ yearsSemiconductorsManufacturingPackaging

Education:Bachelor's

Skills:LeadershipCommunicationMentoringProblem-solvingTeamwork

Tech Stack:GMPLean manufacturingPackagingSingulationProcess engineering

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

Intel

Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor

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Intel

4 weeks ago

Advanced Packaging Singulation Module Engineering Manager

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 59 minutes agoStatus: Live

Job Summary

Location: Albuquerque

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Manager level

Key Responsibilities

•Lead a team of module engineers and manufacturing operations engineers to support high-volume manufacturing with robust and sustainable solutions.
•Provide clear direction and management for daily operations, including maintenance, process engineering prioritization, yield improvement, and efficiency enhancements.
•Drive continuous improvement in safety, quality, output, and cost while fostering a culture of productivity and innovation.
•Recommend and oversee the implementation of modifications to operating equipment to improve production efficiency, manufacturing techniques, and production output.
•Plan and direct activities for process and hardware development to enable the manufacturing of innovative device architectures.

Pay and Benefits

Salary: USD 140,830 - 198,820 annually

Equity and Bonus:Equity

Perks:Health InsuranceEquity

Key Requirements

•Bachelor's degree in engineering, materials science, physics, or a related technical field.
•6+ years of experience with a Bachelor's degree (4+ years with a Master’s or 2+ years with a PhD).
•Experience in process characterization and process improvement within a manufacturing environment.
•Knowledge of GMP and lean manufacturing principles.
•Experience leading engineering teams with a focus on innovation and operational excellence (preferred).

Experience:6+ yearsSemiconductorsManufacturingPackaging

Education:Bachelor's

Skills:LeadershipCommunicationMentoringProblem-solvingTeamwork

Tech Stack:GMPLean manufacturingPackagingSingulationProcess engineering

Eligibility

Work Authorization:Authorization required. Sponsorship not provided.

Company Brief

Intel

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1968

Glassdoor: 3.8

Website LinkedIn Glassdoor