Principal Memory Design Engineer, HBM

Micron Technology
United States
Workplace: OnsiteFull timeFunction: Design (Product/UX/UI/Visual)Skills: ["Analytical thinking","Problem-solving","Cross-functional collaboration","Technical leadership","Communication"]

Design and optimize DRAM circuits for future memory generations, including digital, analog, and memory core circuitry. Lead floorplan and layout process for signal routing, power delivery, sense margins, timings, and die size. Run simulations with FINESIM, HSPICE, and Verilog, model parasitics, and ensure simulation-to-silicon correlation. Coordinate cross-functionally across design, layout, verification, and testing, and drive technical reviews from design through validation.

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FursaFursa
Micron Technology
Micron Technology
3 months ago

Principal Memory Design Engineer, HBM

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Last checked: 6 hours agoStatus: Live

Job Summary

Design and optimize DRAM circuits for future memory generations, including digital, analog, and memory core circuitry. Lead floorplan and layout process for signal routing, power delivery, sense margins, timings, and die size. Run simulations with FINESIM, HSPICE, and Verilog, model parasitics, and ensure simulation-to-silicon correlation. Coordinate cross-functionally across design, layout, verification, and testing, and drive technical reviews from design through validation.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)
Seniority: Mid level

Key Responsibilities

  • •Design and implement DRAM circuits across digital, analog, and memory core circuitry based on device specifications.
  • •Create and optimize floorplans for circuit placement, routing, power delivery, sense margins, timings, and die size.
  • •Conduct circuit simulations, analyze power/speed/reliability, and model parasitics; support validation, reticle experiments, and tape-out revisions.
  • •Confirm simulation-to-silicon correlation and recommend schematic edits to improve performance and reliability.
  • •Manage build and layout resources, monitor task progress, and serve as the primary contact across design, layout, verification, and testing while preparing project status reports.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid Time-offPaid HolidaysPaid Leave

Key Requirements

  • •Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with knowledge of device reliability.
  • •Expertise in Cadence Virtuoso, physical layout, and circuit floor planning.
  • •Experience using FINESIM, HSPICE, and VERILOG for circuit simulation and analysis.
  • •Strong analytical and problem-solving skills with a track record of significant technical contributions.
  • •Deep expertise in DRAM subsystem architecture, specification, operation, or design with the ability to provide cross-department technical leadership.
Experience:SemiconductorMemoryDRAMVLSI
Education:
Skills:Analytical thinkingProblem-solvingCross-functional collaborationTechnical leadershipCommunication
Tech Stack:DRAMHBMCMOSVLSICadence VirtuosoFINESIMHSPICEVerilog

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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