Staff Engineer – Process Development, Dry Etch, NAND

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: bachelorsSkills: ["Analytical problem-solving","Cross-functional communication","Stakeholder management","Prioritization","Mentorship"]

Drive unit process development and module execution for advanced NAND dry etch, owning defined process levels to hit program, yield, and manufacturability targets. Optimize and improve dry etch processes to meet structural/physical and electrical requirements, reduce variability, and increase process capability. Lead root-cause and failure-mode analysis, collaborate across adjacent process areas, support pilot-line sustainment and process transfer, and mentor engineers within the dry etch team.

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Micron Technology
Micron Technology
3 months ago

Staff Engineer – Process Development, Dry Etch, NAND

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Source: Company careers pageValidated by: Fursa AI
Last checked: 16 hours agoStatus: Live

Job Summary

Drive unit process development and module execution for advanced NAND dry etch, owning defined process levels to hit program, yield, and manufacturability targets. Optimize and improve dry etch processes to meet structural/physical and electrical requirements, reduce variability, and increase process capability. Lead root-cause and failure-mode analysis, collaborate across adjacent process areas, support pilot-line sustainment and process transfer, and mentor engineers within the dry etch team.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize dry etch processes for advanced NAND, meeting physical/structural and electrical requirements.
  • •Improve process capability by reducing variability and driving cost/process margin improvements.
  • •Lead root cause and failure mode analysis for process/hardware limitations and engage vendors/suppliers for solutions.
  • •Collaborate with Process Integration and adjacent process areas to integrate solutions and resolve cross-module interactions.
  • •Support pilot-line sustainment and process transfer to manufacturing sites, and contribute to next-generation NAND innovation.

Key Requirements

  • •PhD (≥3 years), Master’s (≥5 years), or Bachelor’s (≥7 years) in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related fields.
  • •Demonstrated experience in dry etch process development and experimental design/data analysis.
  • •Dry etch fundamentals, including plasma physics/chemistry and reactor behavior.
  • •DOE/SPC and statistical analysis skills.
  • •Strong analytical problem-solving and cross-functional communication to manage multiple technical priorities.
Education:Bachelor's in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field
Skills:Analytical problem-solvingCross-functional communicationStakeholder managementPrioritizationMentorship
Tech Stack:Dry etchPlasma physicsPlasma chemistryDOESPCStatistical analysisPythonData scienceGenAIAI-assisted tools

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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