EUV Mask Technology R&D Engineer

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Research & Scientific (R&D)Experience: 2+ yearsEducation: mastersSkills: ["Collaboration","Data-driven problem-solving"]

Join an R&D team at Micron’s Mask Technology Center developing materials, films, and processes for next-generation EUV mask technology. You’ll advance High-NA EUV readiness by designing mask blank materials and processes, translating lithography requirements into manufacturable solutions, and using data-driven DOE and fundamental analysis to improve yield, reliability, and lifetime. Work closely with cross-functional engineering teams and suppliers to transition innovations into FEOL process engineering.

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Micron Technology
Micron Technology
1 month ago

EUV Mask Technology R&D Engineer

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Last checked: 21 hours agoStatus: Live

Job Summary

Join an R&D team at Micron’s Mask Technology Center developing materials, films, and processes for next-generation EUV mask technology. You’ll advance High-NA EUV readiness by designing mask blank materials and processes, translating lithography requirements into manufacturable solutions, and using data-driven DOE and fundamental analysis to improve yield, reliability, and lifetime. Work closely with cross-functional engineering teams and suppliers to transition innovations into FEOL process engineering.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Research & Scientific (R&D)
Seniority: Mid level

Key Responsibilities

  • •Develop EUV mask blank materials and processes, including film stack design, deposition, etch, clean, and patterning quality.
  • •Advance High-NA EUV readiness through material selection, mask design, stitching, lithography performance optimization, and lifetime improvement.
  • •Translate lithography requirements into manufacturable mask solutions in collaboration with OPC, design, and lithography teams.
  • •Conduct data-driven R&D using DOE and fundamental analysis to improve yield, reliability, and manufacturability.
  • •Collaborate with cross-functional engineering teams to transition new technologies into FEOL process engineering.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid Leave

Key Requirements

  • •MS or PhD in Materials Science, Physics, Chemistry, Chemical Engineering, or a related field.
  • •2+ years of experience in semiconductor manufacturing, process development, or equivalent academic research in semiconductor technologies.
  • •Strong background in BEOL or FEOL process control, mask process qualification, or high-volume semiconductor manufacturing.
  • •Hands-on experience with EUV or High-NA EUV mask/wafer technology development.
  • •Experience translating lithography requirements into manufacturable mask solutions, including lithography fundamentals and pattern transfer fidelity.
Experience:2+ yearsSemiconductor manufacturingProcess developmentAcademic research
Education:Master's in Materials Science, Physics, Chemistry, Chemical Engineering, or a related field
Skills:CollaborationData-driven problem-solving
Tech Stack:EUVHigh-NA EUVEUV lithographyDUVMask technologyMask blankFilm stack designDepositionEtchCleanPatterningStitchingOPCDOEActinic mask inspectionDefect printability analysisMask repairFEOLBEOLMask-to-wafer correlation

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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