Module Engineering PhD Intern New 2027

Intel
United States
Workplace: OnsiteInternshipUSD 120,898 - 120,902 annuallyFunction: Research & Scientific (R&D)Education: phdSkills: ["Collaboration","Data analysis","Experimental design","Troubleshooting","Risk assessment"]

Conduct scientific research for semiconductor module process development within Intel Foundry Logic Technology Development (LTD) Metals Thin Films Deposition team. Design, execute, and analyze experiments to support process integration flows, equipment configuration, and yield improvement initiatives by analyzing defect data, troubleshooting issues, and performing risk assessments. Collaborate with engineering teams to optimize metrology strategies and apply statistical design of experiments to improve reliability and throughput for high-volume manufacturing.

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Intel
Intel
1 day ago

Module Engineering PhD Intern New 2027

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Job Summary

Conduct scientific research for semiconductor module process development within Intel Foundry Logic Technology Development (LTD) Metals Thin Films Deposition team. Design, execute, and analyze experiments to support process integration flows, equipment configuration, and yield improvement initiatives by analyzing defect data, troubleshooting issues, and performing risk assessments. Collaborate with engineering teams to optimize metrology strategies and apply statistical design of experiments to improve reliability and throughput for high-volume manufacturing.
Location: United States
Workplace: Onsite
Employment Type: Internship
Job Function: Research & Scientific (R&D)
Seniority: Intern level

Key Responsibilities

  • •Contribute to module process development, continuous improvement, and implementation of semiconductor manufacturing processes within LTD Metals.
  • •Design, execute, analyze experiments, and present conclusions and recommendations.
  • •Collaborate with fab technicians and support experiment execution with clear instructions.
  • •Assist engineering teams in process flow troubleshooting and metrology optimization strategies.
  • •Apply statistical analysis and design experiments to enhance process reliability and throughput.

Pay and Benefits

Salary: USD 120,898 - 120,902 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •PhD student in Chemical Engineering, Electrical Engineering, Material Science, Physics, Chemistry, or Mechanical Engineering (or related).
  • •Knowledge of semiconductor processing fundamentals including thin films deposition, lithography, etching, and polishing.
  • •Hands-on experience with thin film deposition techniques (ALD, CVD, PVD, or electroplating) and characterization tools (ellipsometry, XRF, XPS, XRR, 4-point probe, AFM, SEM, TEM).
  • •Data analysis skills to construct clear data-based problem statements and design experiments.
  • •Preferred: PhD student in 3rd or 4th year with thin film deposition and characterization experience.
Experience:Semiconductor manufacturingThin films
Education:PhD / Doctorate in Chemical Engineering, Electrical Engineering, Material Science, Physics, Chemistry, or Mechanical Engineering (or related)
Skills:CollaborationData analysisExperimental designTroubleshootingRisk assessment
Tech Stack:Thin films depositionLithographyEtchingPolishingALDCVDPVDElectroplatingEllipsometryXRFXPSXRR4-point probeAFMSEMTEMStatistical analysisDesign of experiments

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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