Senior Quantum 3D Integration and Packaging Engineer

Applied Materials
Singapore
Workplace: OnsiteFull timeFunction: Capital Markets, Trading & QuantExperience: 5+ yearsSkills: ["Problem-solving","Technical communication","Cross-functional collaboration","Data analysis","Troubleshooting"]

Design and optimize advanced 3D integration and packaging solutions for quantum devices and emerging quantum platforms. Work with advanced packaging, process, hardware, and metrology teams to develop new materials, processes, and structures. Conduct experiments, analyze data, troubleshoot complex issues using root cause analysis, and compile internal/external technical documentation. Partner with customers, startups, and universities alongside global R&D teams to enable lower-error quantum technologies.

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FursaFursa
Applied Materials
Applied Materials
4 days ago

Senior Quantum 3D Integration and Packaging Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 17 hours agoStatus: Live

Job Summary

Design and optimize advanced 3D integration and packaging solutions for quantum devices and emerging quantum platforms. Work with advanced packaging, process, hardware, and metrology teams to develop new materials, processes, and structures. Conduct experiments, analyze data, troubleshoot complex issues using root cause analysis, and compile internal/external technical documentation. Partner with customers, startups, and universities alongside global R&D teams to enable lower-error quantum technologies.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Capital Markets, Trading & Quant
Seniority: Mid level

Key Responsibilities

  • •Create 3D integration and packaging solutions for different platforms and quantum structures.
  • •Collaborate with packaging, process, hardware, and metrology teams to develop new materials, processes, and structures for quantum devices.
  • •Design and execute process engineering experiments, collecting and analyzing data while following safety guidelines.
  • •Troubleshoot complex process engineering problems using root cause analysis and resolution of engineering issues.
  • •Generate internal and external documentation for products, presentations, and technical reports.

Pay and Benefits

Perks:Employee AssistanceFamily SupportTravel Allowance

Key Requirements

  • •PhD, Master’s, or Bachelor’s degree in Materials Science, Electrical Engineering, Physics, Microelectronics, or a related field.
  • •5+ years of experience in advanced packaging, 3D integration, heterogeneous integration, or semiconductor process development.
  • •Strong knowledge of wafer-level packaging and related technologies including hybrid bonding, TSV, chiplets, and flip-chip.
  • •Hands-on experience with semiconductor fabrication, process integration, materials characterization, and metrology.
  • •Experience with DOE, data analysis, process optimization, and root cause analysis.
Experience:5+ yearsSemiconductorQuantum technology3D integrationAdvanced packaging
Education:
Skills:Problem-solvingTechnical communicationCross-functional collaborationData analysisTroubleshooting
Tech Stack:3D integrationQuantum devicesSuperconducting qubitsOptical quantum computingWafer-level packagingHybrid bondingTSVChipletsFlip-chipMetrologyDOERoot cause analysisMetasurface-based opticsSemiconductor process developmentMaterials characterization

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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