Packaging Research and Development Engineer

Intel
Phoenix
Workplace: OnsiteFull timeUSD 133,800 - 188,890 annuallyFunction: Research & Scientific (R&D)Experience: 1+ yearsEducation: phdSkills: ["Communicates clearly","Collaboration","Analytical problem-solving","Adaptability","Ownership"]

Develop and scale advanced substrate packaging technologies for die disaggregation and heterogeneous integration. Work primarily on the factory floor to define equipment configurations, process specifications, and end-to-end process flows, and run Design of Experiments to characterize process windows. Improve process capability, quality, reliability, cost, and yield, partnering with cross-functional teams and equipment/material suppliers. Use analytical tools and statistical data analysis (including Python) to drive actionable insights.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Intel
Intel
5 days ago

Packaging Research and Development Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 2 hours agoStatus: Live
Reposted: similar role first listed 4 months ago

Job Summary

Develop and scale advanced substrate packaging technologies for die disaggregation and heterogeneous integration. Work primarily on the factory floor to define equipment configurations, process specifications, and end-to-end process flows, and run Design of Experiments to characterize process windows. Improve process capability, quality, reliability, cost, and yield, partnering with cross-functional teams and equipment/material suppliers. Use analytical tools and statistical data analysis (including Python) to drive actionable insights.
Location: Phoenix
Workplace: Onsite
Employment Type: Full time
Job Function: Research & Scientific (R&D)
Seniority: Entry level

Key Responsibilities

  • •Define and establish equipment configurations, process specifications, and integrated process flows for new substrate packaging technologies.
  • •Plan and conduct Design of Experiments (DOEs) to characterize process windows and understand interactions between processes, equipment, and materials.
  • •Drive continuous improvements in process capability and stability, quality and reliability, cost and yield, automation, and overall productivity.
  • •Lead and participate in cross-functional working groups supporting substrate technology development.
  • •Collaborate with equipment and materials suppliers to evaluate, qualify, and optimize new technologies and solutions.
Travel: Low travel

Pay and Benefits

Salary: USD 133,800 - 188,890 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •PhD degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a closely related field.
  • •1+ years of relevant experience in a science or engineering field (via academic research, internships, or professional experience).
  • •Experience troubleshooting and performing analytical problem-solving on integrated technology challenges in cross-functional engineering teams.
  • •Experience owning and operating process tools, including Statistical Process Control (SPC), process change systems (PCS), Request for Change (RFC), equipment troubleshooting, and statistical design of experiments.
  • •Familiarity with characterization techniques for organic and inorganic materials (e.g., DSC, TGA, D/TMA, ICP-MS, FTIR, XPS, TOF-SIMS, EDX, SEM).
Experience:1+ years
Education:PhD / Doctorate in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry (or closely related field)
Skills:Communicates clearlyCollaborationAnalytical problem-solvingAdaptabilityOwnership
Tech Stack:JMPJSLPythonStatistical Process Control (SPC)Process Change Systems (PCS)Request for Change (RFC)Design of Experiments (DOE)DSCTGAD/TMAICP-MSFTIRXPSTOF-SIMSEDXSEMTitrationMachine learning conceptsRelational database structures

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
WebsiteLinkedInGlassdoor