Sr Advanced Packaging Technology Development Engineer, FILM process

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: mastersSkills: ["Independent thinking","Teamwork","Communication","Root cause analysis"]

Drive HBM FILM process development and yield improvement, supporting advanced packaging R&D such as chip stacking and 2.5D/3D integration. Provide on-site technical consulting, troubleshoot complex process issues using root-cause analysis, and author technical documentation for presentations and reports. Partner cross-functionally on materials characterization and mechanical characterization, recommend test structures, and present data with recommendations to packaging materials suppliers.

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FursaFursa
Micron Technology
Micron Technology
2 weeks ago

Sr Advanced Packaging Technology Development Engineer, FILM process

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Source: Company careers pageValidated by: Fursa AI
Last checked: 3 hours agoStatus: Live
Reposted: similar role first listed 1 week ago

Job Summary

Drive HBM FILM process development and yield improvement, supporting advanced packaging R&D such as chip stacking and 2.5D/3D integration. Provide on-site technical consulting, troubleshoot complex process issues using root-cause analysis, and author technical documentation for presentations and reports. Partner cross-functionally on materials characterization and mechanical characterization, recommend test structures, and present data with recommendations to packaging materials suppliers.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Sr. Manager level

Key Responsibilities

  • •Drive HBM process development and yield improvement in FILMs process.
  • •Support advanced package technology R&D (chip stacking, 2.5D or 3D) and coordinate on-site project execution.
  • •Troubleshoot complex problems using root-cause analysis to resolve process engineering issues.
  • •Provide recommendations for test structure and test vehicle design for materials property evaluation.
  • •Review, summarize, and present data with recommendations and lead discussions with packaging materials suppliers.

Key Requirements

  • •Master’s (PhD a plus) in Chemistry, Physics, Materials, or related engineering science fields.
  • •At least 3 years of experience in FILMs (CVD, PVD) in a related industry.
  • •Solid understanding of thin film deposition principles.
  • •Understanding of process characteristics including film uniformity, stress, adhesion, step coverage, and defect behavior.
  • •Hands-on tool experience with CVD/PVD production tools (e.g., AMAT, LAM, TEL) is a plus.
Education:Master's in Chemistry, Physic, Material, engineering science related fields
Skills:Independent thinkingTeamworkCommunicationRoot cause analysis
Languages:EnglishChinese
Tech Stack:HBMFILMsCVDPVDAMATLAMTELThin film deposition

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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