RF Device Modeling Engineer

Texas Instruments
Bengaluru
Workplace: OnsiteFull timeFunction: Research & Scientific (R&D)Education: mastersSkills: ["Communication","Planning","Schedule management","Cross-functional collaboration","Data analysis"]

Join TI’s SPICE Modeling Group to extract and optimize compact RF semiconductor models for next-generation devices. You’ll collaborate with analog, digital, and mixed-signal teams to deploy modeling solutions, develop new model formulations, and automate modeling infrastructure. The role also includes building AI/ML-enhanced models and parameter extraction methods, then validating accuracy through measurement and analysis to support design-technology co-optimization.

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FursaFursa
Texas Instruments
Texas Instruments
5 days ago

RF Device Modeling Engineer

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Job Summary

Join TI’s SPICE Modeling Group to extract and optimize compact RF semiconductor models for next-generation devices. You’ll collaborate with analog, digital, and mixed-signal teams to deploy modeling solutions, develop new model formulations, and automate modeling infrastructure. The role also includes building AI/ML-enhanced models and parameter extraction methods, then validating accuracy through measurement and analysis to support design-technology co-optimization.
Location: Bengaluru
Workplace: Onsite
Employment Type: Full time
Job Function: Research & Scientific (R&D)

Key Responsibilities

  • •Extract compact SPICE models for advanced semiconductor devices including HBT/BJT, RF CMOS, RF passives, and GaN.
  • •Collaborate with designers and technologists to deploy modeling solutions for RF circuit topologies and drive design-technology co-optimization.
  • •Develop innovative model formulations for emerging device technologies.
  • •Automate modeling infrastructure to accelerate technology development.
  • •Develop AI/ML-enhanced models and parameter extraction methodologies and validate models through measurement and analysis.

Key Requirements

  • •Ph.D./Masters in Electrical Engineering or related field.
  • •5+ years in compact (SPICE) RF modeling for HBT/BJT and CMOS.
  • •Expert-level RF characterization, modeling, and circuit-level validation using metrics such as s-parameters, noise figure, linearity, IMP3/IP3, and harmonic distortion.
  • •Strong understanding of RF test-structures, layouts, and calibration/de-embedding techniques.
  • •Experience with device models and parameter extraction tools (e.g., BSIM, MEXTRAM, HICUM, ICCAP, BSIMPro+, MBP) plus semiconductor physics and circuit analysis.
Experience:SemiconductorsRF modelingCompact (SPICE) modelingHBT/BJTCMOSAI/ML
Education:Master's in Electrical Engineering
Skills:CommunicationPlanningSchedule managementCross-functional collaborationData analysis
Tech Stack:SPICEHBTBJTRF CMOSRF PassivesGaNS-parametersNoise figureIMP3IP3Harmonic distortionRF test-structuresCalibrationDe-embeddingBSIMMEXTRAMHICUMMVSG-GANASMICCAP

Company Brief

Texas Instruments
Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Dallas, United States
Founded: 1930
WebsiteLinkedIn