Wafer Fab Process Engineer

Broadcom
Singapore
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 5+ yearsEducation: bachelorsSkills: ["Leadership","Analytical skills","Problem-solving","Communication","Cross-functional collaboration"]

Lead semiconductor wafer-fab process development and optimization, driving module ownership across thin film deposition, wafer thinning, and thermal processes. Improve yield and reduce defects using statistical methods and DOE, while executing NPI and transferring processes to high-volume manufacturing. Perform root-cause analysis with corrective/preventive actions, define SPC and process control strategies, and partner with equipment, integration, quality, and R&D teams, mentoring junior engineers.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Broadcom
Broadcom
4 weeks ago

Wafer Fab Process Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 4 hours agoStatus: Live
Reposted: similar role first listed 3 weeks ago

Job Summary

Lead semiconductor wafer-fab process development and optimization, driving module ownership across thin film deposition, wafer thinning, and thermal processes. Improve yield and reduce defects using statistical methods and DOE, while executing NPI and transferring processes to high-volume manufacturing. Perform root-cause analysis with corrective/preventive actions, define SPC and process control strategies, and partner with equipment, integration, quality, and R&D teams, mentoring junior engineers.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Own and drive advanced process modules including thin film deposition, wafer thinning, and thermal processes such as oxidation, diffusion, and implantation.
  • •Lead yield improvement and defect reduction initiatives using statistical methods and DOE.
  • •Drive new process integration (NPI) and transfer processes to high-volume manufacturing.
  • •Perform root cause analysis and implement corrective and preventive actions.
  • •Define process control plans, SPC strategies, and execute OCAP while collaborating with equipment, integration, quality, and R&D teams.

Key Requirements

  • •Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).
  • •At least 5 years of semiconductor wafer fab process experience in thin film deposition (metal/passivation) and/or thermal oxidation, diffusion, and implantation.
  • •Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
  • •Demonstrated leadership in cross-functional technical projects.
  • •Strong analytical, problem-solving, and communication skills.
Experience:5+ yearsSemiconductor manufacturingWafer fabricationProcess development
Education:Bachelor's in Electrical, Chemical, Materials (or related)
Skills:LeadershipAnalytical skillsProblem-solvingCommunicationCross-functional collaboration
Certifications:Six Sigma (Green/Black Belt)
Tech Stack:SPCDOEFMEAStatistical data analysisSix Sigma

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn