SPG SmartStart Manufacturing Engineer

Applied Materials
Singapore
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringEducation: bachelorsSkills: ["Analytical thinking","Problem-solving","Communication","Cross-functional collaboration","Independent work ethic"]

Develop and sustain semiconductor start-up processes and field digitalized procedures (iOMS) for Tier 0/Tier 1 operations. Own BoM integrity and drive automation and procedure improvements to reduce I&W costs, field nonconformities, and start-up cycle time. Perform root-cause analysis, coordinate RIT and CIP initiatives (e.g., 3D OMS) across teams, and support engineering change requests and product improvement releases.

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FursaFursa
Applied Materials
Applied Materials
6 days ago

SPG SmartStart Manufacturing Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 4 hours agoStatus: Live

Job Summary

Develop and sustain semiconductor start-up processes and field digitalized procedures (iOMS) for Tier 0/Tier 1 operations. Own BoM integrity and drive automation and procedure improvements to reduce I&W costs, field nonconformities, and start-up cycle time. Perform root-cause analysis, coordinate RIT and CIP initiatives (e.g., 3D OMS) across teams, and support engineering change requests and product improvement releases.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop, implement, and maintain assembly start-up methods, operating sequences, and processes for semiconductor equipment.
  • •Lead development and sustain field digitalized start-up procedures (iOMS) for Tier 0 & Tier 1 to improve efficiency and consistency.
  • •Manage BoM integrity across configuration sources (SHPK, MERG, ship-along, SRD, etc.) to ensure accuracy and alignment with product requirements.
  • •Drive automation and procedural initiatives to reduce production/delivery cycle times and lower installation & warranty (I&W) costs.
  • •Review field nonconformities, conduct root-cause analysis, and coordinate RIT and CIP projects (including 3D OMS) across business units; support engineering change requests.
Travel: Low travel

Pay and Benefits

Perks:Learning BudgetTravel Allowance

Key Requirements

  • •Bachelor’s degree in engineering.
  • •Minimum 4 years of experience working with semiconductor equipment in manufacturing or technical field service.
  • •Hands-on experience with semiconductor process equipment; familiarity with MDP, EPI, ALD, or CMP is an advantage.
  • •Good knowledge of system BoM structure, assembly processes, and procedure documentation.
  • •Proficiency with CAD/CAM tools (SolidWorks, NX), SAP, and MS Office.
Experience:Semiconductor manufacturing
Education:Bachelor's
Skills:Analytical thinkingProblem-solvingCommunicationCross-functional collaborationIndependent work ethic
Tech Stack:SolidWorksNXSAPMS OfficeCADCAMIOMS3D OMSBoMSHPKMERGSRD

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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