New College Grad - HBM Design Architect | MS or PhD

Micron Technology
Texas
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringSkills: ["Analytical thinking","Problem-solving","Written communication","Verbal communication","Cross-functional collaboration"]

Contribute to the evaluation and development of next-generation HBM and DRAM architectures within Micron’s Heterogeneous Integration Group (HBM Architecture) team. You’ll analyze performance, power, area, thermal behavior, reliability, and manufacturability using models and simulations, support design pathfinding, perform root-cause analysis, and communicate findings through reviews and documentation—leveraging AI/LLMs to accelerate architecture exploration.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
1 week ago

New College Grad - HBM Design Architect | MS or PhD

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 1 hour agoStatus: Live

Job Summary

Contribute to the evaluation and development of next-generation HBM and DRAM architectures within Micron’s Heterogeneous Integration Group (HBM Architecture) team. You’ll analyze performance, power, area, thermal behavior, reliability, and manufacturability using models and simulations, support design pathfinding, perform root-cause analysis, and communicate findings through reviews and documentation—leveraging AI/LLMs to accelerate architecture exploration.
Location: Texas
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Entry level

Key Responsibilities

  • •Analyze HBM and DRAM architectures using analytical models, simulations, silicon data, and AI-assisted techniques across timing, bandwidth, power, area, thermal performance, reliability, and design complexity.
  • •Develop and apply modeling, simulation, and data-analysis methodologies to compare architectural approaches, identify design sensitivities, and support technology pathfinding.
  • •Collaborate with architecture, circuit design, layout, packaging, product, and system teams to assess implementation feasibility, performance tradeoffs, signal integrity, power delivery, and manufacturability.
  • •Perform root-cause analysis using simulation and measured data to improve model accuracy, validate assumptions, and produce evidence-based design recommendations.
  • •Present and document technical findings through presentations, design reviews, architecture discussions, and written documentation with assumptions, risks, and recommended actions.

Pay and Benefits

Perks:Health InsurancePaid LeavePaid HolidaysParental LeaveWellness Stipend

Key Requirements

  • •Master's or Ph.D. degree in Electrical Engineering, Computer Engineering, or a related field completed before employment start.
  • •Strong foundation in at least two areas such as CMOS circuits, digital/mixed-signal design, semiconductor devices, computer architecture, memory systems, thermal sciences, signal integrity, power delivery, or advanced packaging.
  • •Experience developing engineering models, simulations, or analytical methodologies through graduate research, coursework, internships, or laboratory projects.
  • •Ability to evaluate complex technical problems and draw evidence-based conclusions while communicating recommendations to multidisciplinary teams.
  • •Strong analytical, problem-solving, written, and verbal communication skills.
Education:
Skills:Analytical thinkingProblem-solvingWritten communicationVerbal communicationCross-functional collaboration
Tech Stack:AILarge Language Models (LLMs)Generative AIHSPICEFineSimSpectreCMOSDigital designMixed-signal designSignal integrityPower delivery

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn