FPD-Link Applications Engineer

Texas Instruments
Shanghai, Shenzhen
Workplace: OnsiteFull timeFunction: Software EngineeringExperience: 3+ yearsEducation: bachelorsSkills: ["Customer-facing communication","Root-cause analysis","Problem solving","Team collaboration","Technical documentation"]

Collaborate with Tier 1 and OEM engineering teams to architect and optimize IVI and ADAS end products supported by TI’s FPD-Link SerDes solutions. Provide both software and hardware application support, including customer schematic/PCB layout reviews and system bring-up with on-site debug and in-lab validation. Own customer escalations with root-cause analysis across hardware, software, and system interactions, and develop application notes, debug guides, EVMs, and lab demos.

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FursaFursa
Texas Instruments
Texas Instruments
2 months ago

FPD-Link Applications Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 11 hours agoStatus: Live

Job Summary

Collaborate with Tier 1 and OEM engineering teams to architect and optimize IVI and ADAS end products supported by TI’s FPD-Link SerDes solutions. Provide both software and hardware application support, including customer schematic/PCB layout reviews and system bring-up with on-site debug and in-lab validation. Own customer escalations with root-cause analysis across hardware, software, and system interactions, and develop application notes, debug guides, EVMs, and lab demos.
Location: Shanghai, Shenzhen
Workplace: Onsite
Employment Type: Full time
Job Function: Software Engineering
Seniority: Mid level

Key Responsibilities

  • •Work directly with Tier 1 and OEM engineering teams to architect and optimize IVI and ADAS end products.
  • •Provide SW and HW support to ensure robust, high-performance automotive and industrial solutions.
  • •Review customer schematics, PCB layout, high-speed routing, and system integration details.
  • •Support system bring-up, on-site debug, and in-lab validation activities as needed.
  • •Own customer escalations and perform root-cause analysis across hardware, software, and system interactions.

Key Requirements

  • •Bachelor's degree in Electrical Engineering, ECE, or related field.
  • •3+ years of relevant experience in high-speed interfaces, automotive electronics, or applications engineering.
  • •Foundational understanding of FPD-Link, SerDes protocols, or other high-speed signaling architectures.
  • •Experience in customer-facing technical roles.
  • •Strong written and verbal communication skills with solid hardware and software debugging ability.
Experience:3+ yearsAutomotive electronicsHigh-speed interfacesApplications engineeringAutomotive imaging
Education:Bachelor's in Electrical Engineering, ECE, or related field
Skills:Customer-facing communicationRoot-cause analysisProblem solvingTeam collaborationTechnical documentation
Tech Stack:FPD-LinkSerDesHigh-speed interfacesIVIADASOscilloscopesLogic analyzersProtocol toolsEMC/EMI debuggingEVMsReference designsPCB layoutHigh-speed routing

Company Brief

Texas Instruments
Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Dallas, United States
Founded: 1930
WebsiteLinkedIn