Engineer, Product Development Engineering Key Equipment Group (PDE KEG)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & Community0Education: bachelorsSkills: ["Initiative","Independence","Teamwork","Communication","Presentation","Project management","Analytical thinking","Critical thinking","Growth mindset","Cross-functional collaboration"]

Identify, select, and evaluate new highly automated equipment and technologies to support current and future advantage packaging requirements. Own installation and qualification activities for new equipment platforms, define equipment design/capability requirements aligned to the Process and Packaging Roadmap, and coordinate handover to production. Maintain equipment maturity expectations (EMI) and tool constraints (TOR), enable equipment automation systems (including monitoring and control), and partner with suppliers through benchmarking and engagement programs to drive continuous improvement.

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FursaFursa
Micron Technology
Micron Technology
4 days ago

Engineer, Product Development Engineering Key Equipment Group (PDE KEG)

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 13 hours agoStatus: Live
Reposted: similar role first listed 6 months ago

Job Summary

Identify, select, and evaluate new highly automated equipment and technologies to support current and future advantage packaging requirements. Own installation and qualification activities for new equipment platforms, define equipment design/capability requirements aligned to the Process and Packaging Roadmap, and coordinate handover to production. Maintain equipment maturity expectations (EMI) and tool constraints (TOR), enable equipment automation systems (including monitoring and control), and partner with suppliers through benchmarking and engagement programs to drive continuous improvement.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Entry level

Key Responsibilities

  • •Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness while complying with standards and legal requirements.
  • •Support evaluation and qualification of new equipment platforms, including planning capital requests, defining qualification criteria, and coordinating handover to production.
  • •Define, develop, and establish new equipment design/capability requirements aligned to the Process and Packaging Roadmap.
  • •Maintain and regularly update equipment capability and constraints using EMI and TOR, including driving maturity expectations and maintaining knowledge of process/material characteristics.
  • •Enable equipment system readiness and enhancement by characterizing equipment, enabling critical monitoring/controls with PCS/IT & Automation, and supporting automation solution readiness and deployment.
Travel: Low travel

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendHealth InsuranceEquity

Key Requirements

  • •PhD/Masters/bachelor’s degree in electrical & electronic, material, mechanical engineering, physics & applied physics, or equivalent experience.
  • •Basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies, and advanced packaging techniques.
  • •0-2 years of experience in a related semiconductor industry or manufacturing environment.
  • •Experience/technical knowledge on assembly, wafer bumping, or advanced packaging technology is a plus.
  • •Fast learner with initiative and independence (minimal supervision), strong communication (verbal and written), and ability to integrate with cross-functional teams and external vendors.
Experience:0SemiconductorSemiconductor manufacturingPackagingAdvanced packagingSemiconductor assemblyAutomationAI
Education:Bachelor's
Skills:InitiativeIndependenceTeamworkCommunicationPresentationProject managementAnalytical thinkingCritical thinkingGrowth mindsetCross-functional collaboration
Languages:English
Tech Stack:AI-assisted toolsFDCE3APCInternet of Things (IOT)ECMR2RPCSIT & AutomationAMHSTool of records (TOR)Equipment maturity index (EMI)Data gathering

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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