R&D Engineer IC Design

Broadcom
San Jose
Workplace: OnsiteFull timeUSD 120,000 - 192,000 annuallyFunction: Design (Product/UX/UI/Visual)Skills: ["Communication","Problem-solving","Teamwork","Documentation"]

Design interposer and CoWoS 2.5D/3D packaging solutions for Broadcom’s network switch products, driving routing, bump mapping, and verification from design through tapeout. Collaborate with IC design, packaging, SI/PI, and foundry teams to meet interposer packaging and high-speed interface requirements using state-of-the-art EDA tools.

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FursaFursa
Broadcom
Broadcom
7 months ago

R&D Engineer IC Design

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 days agoStatus: Live

Job Summary

Design interposer and CoWoS 2.5D/3D packaging solutions for Broadcom’s network switch products, driving routing, bump mapping, and verification from design through tapeout. Collaborate with IC design, packaging, SI/PI, and foundry teams to meet interposer packaging and high-speed interface requirements using state-of-the-art EDA tools.
Location: San Jose
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)

Key Responsibilities

  • •Design interposers and advanced packaging structures including CoWoS 2.5D/3D, performing routing, bump map design, and physical verification up to tapeout
  • •Collaborate with packaging, signal integrity, and foundry teams to meet packaging, SI, PI, and thermal requirements for interposers
  • •Develop and automate interposer design flows and bump pattern generation using scripting languages
  • •Coordinate with cross functional teams to ensure designs meet manufacturing and reliability standards
  • •Document design processes, specifications, and design reviews throughout the development lifecycle

Pay and Benefits

Salary: USD 120,000 - 192,000 annually
Perks:MedicalDentalVision401kEsppEapPaid HolidaysPaid Leave

Key Requirements

  • •Bachelor's in Electrical Engineering, Microelectronics, or related field with 8+ years of related experience, or a Master’s degree with 6+ years of related experience
  • •Strong experience with interposer and advanced packaging design, including CoWoS, 2.5D/3D
  • •Proficiency with EDA tools such as Cadence (Innovus, Integrity), Synopsys (3DIC compiler), Mentor Graphics (Calibre) for layout generation, editing and verification
  • •Strong understanding of TSV design, micro-bumps, solder bumps, and interconnect technologies
  • •Strong scripting skills (Python, Tcl, SKILL) for automation and flow customization
Experience:SemiconductorAdvanced packagingInterposer
Education:
Skills:CommunicationProblem-solvingTeamworkDocumentation
Languages:English
Tech Stack:Cadence InnovusCadence IntegritySynopsys 3DIC compilerMentor CalibreTSVPythonTclSKILL

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn