AMD

1 month ago

Director, EMO_BackEnd Engineering

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Last checked: 6 hours agoStatus: Live

Job Summary

Director leading External Manufacturing Operations for backend engineering in Hsinchu, focusing on Substrates & PCB MFG and Advanced Packaging. Responsible for NPIs, ramp activities, HVM sustaining, supplier qualification, process optimization, and data-driven improvements in yield and CIP, with strong cross-functional leadership and English communication.

Location: Taiwan

Workplace: Onsite

Employment Type: Full time

Job Function: Software Engineering

Seniority: Director level

Key Responsibilities

•Plan, Drive and Manage Substrate & PCB supplier and AMD internal stakeholders from NPI bring up/Qualification/ Ramp Up readiness to Production release and sustaining.
•Supplier Qualification - NPI to LVM to HVM, with First pass and Issue free production for 6 months to ensure Repeatability and Reproducibility.
•Substrate & PCB supplier’s new production site bring up & qualification.
•Drive HVM yield attainment, sustaining-issue resolution and issue prevention and improvements through Data Analytics. System Integration with Data Analytics to have real time update and control over supplier overall performance.
•Lead knowledge-sharing initiatives (Best Known Methods, lessons learned) and drive Continuous Improvement Projects (CIPs).
•Monitor & Drive supplier performance using scorecards and lead quarterly technical reviews to ensure improvements.
•Lead projects to drive cross supplier performance improvement/quality enhancement
•Drive for supplier engagement on continuous improvement. Drive supplier to enhance process, equipment & material capability for future generation/technology products and capabilities ahead of roadmap needs.
•Plan and execute change management.

Key Requirements

•Minimum 20 years+ experience in IC Substrate/PCB Engineering & Operations or with Fabless companies (Managing substrate suppliers)
•Experience across multiple internal functions and strong cross-functional collaboration
•Technical expertise in FC-BGA, LGA, Advanced Packaging Substrates & PCB Manufacturing/Development
•Experience in substrate/PCB development from NPI to HVM is a plus
•Team leadership with ability to drive solutions, meet deadlines, and excellent English communication

Experience:20+ years

Education:Bachelor's

Skills:Data AnalyticsProject ManagementLeadershipCommunicationProblem-Solving

Languages:English

Tech Stack:FC-BGALGAAdvanced PackagingPCB ManufacturingData Analytics

Company Brief

AMD

Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1969

Glassdoor: 3.9

Website LinkedIn

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AMD