Dry/Plasma Etch Process Development Engineer (R&D)

Texas Instruments
Dallas
Workplace: OnsiteFull timeUSD 90,000 - 159,500 annuallyFunction: Research & Scientific (R&D)Experience: 2+ yearsEducation: mastersSkills: ["Technical leadership","Communication","Interpersonal skills","Analytical skills","Problem-solving"]

Develop, characterize, and optimize plasma etch (FEOL/BEOL) unit processes for semiconductor devices to meet volume-production requirements. Serve as a technical leader on advanced technology development, driving process/device improvements through characterization, test, design of experiments, data analysis, and simulation. Collaborate with process integration, reliability, packaging, and test engineers and partner with product groups to deliver robust, reliable, and manufacturable device performance targets.

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FursaFursa
Texas Instruments
Texas Instruments
2 days ago

Dry/Plasma Etch Process Development Engineer (R&D)

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Last checked: 2 hours agoStatus: Live

Job Summary

Develop, characterize, and optimize plasma etch (FEOL/BEOL) unit processes for semiconductor devices to meet volume-production requirements. Serve as a technical leader on advanced technology development, driving process/device improvements through characterization, test, design of experiments, data analysis, and simulation. Collaborate with process integration, reliability, packaging, and test engineers and partner with product groups to deliver robust, reliable, and manufacturable device performance targets.
Location: Dallas
Workplace: Onsite
Employment Type: Full time
Job Function: Research & Scientific (R&D)
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize plasma etch unit processes (FEOL/BEOL) to meet volume-production requirements.
  • •Characterize and improve process/device performance to ensure robustness, reliability, and manufacturability.
  • •Drive process and device improvements using characterization, test, DOE, data analysis, and simulation.
  • •Collaborate with process integration, reliability, packaging, and test engineers to achieve shared development goals.
  • •Partner with product groups to identify and optimize dry etch unit processes to meet critical final device parameters.

Pay and Benefits

Salary: USD 90,000 - 159,500 annually

Key Requirements

  • •Master’s degree in Electrical Engineering, Mechanical Engineering, or a related engineering field.
  • •2+ years of experience working on plasma etch unit processes in a fab and taking them from development to production on schedule.
  • •Demonstrated ability to plan effectively and drive schedules to meet critical deadlines on multiple parallel tasks.
  • •Ability to lead technical discussions in plasma etching and clearly communicate project status and actions.
  • •Ability to interface across organizational boundaries and work effectively on diverse teams.
Experience:2+ yearsSemiconductorsSemiconductor manufacturingPlasma etchingAdvanced technology development
Education:Master's
Skills:Technical leadershipCommunicationInterpersonal skillsAnalytical skillsProblem-solving
Tech Stack:Plasma etch processesFEOL/BEOLCharacterizationTestDesign of experimentsData analysisSimulation

Company Brief

Texas Instruments
Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Dallas, United States
Founded: 1930
WebsiteLinkedIn