Senior/ Staff STPG NAND Product Development Engineer – Test Chip Vehicle

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 5+ yearsEducation: bachelorsSkills: ["Technical leadership","Cross-functional influence","Root cause analysis","Mentoring","Problem-solving"]

Provide technical leadership for the full learning loop of a NAND test chip vehicle (TCV), owning pre-silicon simulation and regression planning through tape-out, then driving silicon debug and validation after bring-up. Define test modes, patterns, and flows to maximize learning from characterization data, perform root-cause analysis, and establish simulation-to-silicon correlation methods. Apply advanced data analytics (including AI adoption) and author reusable technical documentation to improve next-generation NAND flash products.

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Micron Technology
Micron Technology
4 months ago

Senior/ Staff STPG NAND Product Development Engineer – Test Chip Vehicle

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Source: Company careers pageValidated by: Fursa AI
Last checked: 7 hours agoStatus: Live

Job Summary

Provide technical leadership for the full learning loop of a NAND test chip vehicle (TCV), owning pre-silicon simulation and regression planning through tape-out, then driving silicon debug and validation after bring-up. Define test modes, patterns, and flows to maximize learning from characterization data, perform root-cause analysis, and establish simulation-to-silicon correlation methods. Apply advanced data analytics (including AI adoption) and author reusable technical documentation to improve next-generation NAND flash products.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Own pre-silicon validation strategy for the TCV by partnering with Design, Process, and TD to determine what must be proven in simulation versus silicon.
  • •Develop, maintain, and execute simulation and regression frameworks (functional, parametric, stress, corner), including coverage expectations and exit criteria.
  • •Provide technical ownership for TCV bring-up through characterization readiness, including probe enablement, trims, operating conditions, and debug strategies.
  • •Lead electrical characterization and deep root-cause analysis for silicon anomalies, distinguishing design, process, model, or test limitations.
  • •Architect TCV test modes, patterns, and flows; translate simulation and silicon findings into actionable recommendations and reusable technical documentation.

Key Requirements

  • •Bachelor’s or post-graduate degree in Electrical/Electronics/Computer Engineering (or related) with a minimum of 5 years of relevant industrial experience.
  • •Strong fundamentals in CMOS/MOSFET device physics, memory circuits, and semiconductor devices.
  • •Experience owning pre-silicon simulation/regression and post-silicon test/validation for complex designs.
  • •Strong data analysis and scripting skills (Python, JMP, or equivalent) applied to large datasets.
  • •Ability to drive ambiguous technical problems to closure with minimal supervision.
Experience:5+ yearsSemiconductorsMemoryNAND flashPre-silicon validationPost-silicon testingSimulationSilicon debugData analytics
Education:Bachelor's in Electrical/ Electronics/ Computer Engineering (or related)
Skills:Technical leadershipCross-functional influenceRoot cause analysisMentoringProblem-solving
Tech Stack:PythonJMPDFTAI/MLSimulationRegressionProbe test infrastructure

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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