Advanced Packaging Top Die Module Engineer

Intel
Albuquerque
Workplace: OnsiteFull timeUSD 103,730 - 198,820 annuallyFunction: Industrial, Process & Manufacturing EngineeringExperience: 4+ yearsEducation: bachelorsSkills: ["Communication","Collaboration"]

Lead and optimize high-volume semiconductor manufacturing for advanced packaging top die modules. Operate and improve critical equipment and processes to control dimensions, defectivity, and yield, using tests/measurements and data-driven approaches like Design of Experiments (DOE). Perform maintenance, execute excursion prevention, and drive continuous improvement across safety, productivity, cost efficiency, and quality. Support equipment ramp-ups and global technology transfer through training, audits, and documentation.

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Intel
Intel
12 hours ago

Advanced Packaging Top Die Module Engineer

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 12 hours agoStatus: Live
Reposted: similar role first listed 2 months ago

Job Summary

Lead and optimize high-volume semiconductor manufacturing for advanced packaging top die modules. Operate and improve critical equipment and processes to control dimensions, defectivity, and yield, using tests/measurements and data-driven approaches like Design of Experiments (DOE). Perform maintenance, execute excursion prevention, and drive continuous improvement across safety, productivity, cost efficiency, and quality. Support equipment ramp-ups and global technology transfer through training, audits, and documentation.
Location: Albuquerque
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Operate and optimize high-volume manufacturing equipment and processes to control critical dimensions and defectivity.
  • •Conduct tests and measurements to evaluate equipment and process performance, recommending modifications to improve productivity and quality.
  • •Execute maintenance, repair, and upgrades for assigned equipment and modules to ensure consistent operational excellence.
  • •Lead continuous improvement initiatives to enhance safety, productivity, cost efficiency, and yield.
  • •Develop and implement excursion prevention systems and support technology transfer via training, audits, and documentation; oversee installation, conversion, and qualification during factory ramps.

Pay and Benefits

Salary: USD 103,730 - 198,820 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor’s degree in a STEM field or related discipline.
  • •4+ years of relevant experience (or 3+ years with a Master’s; or no experience required with a PhD).
  • •Proficiency in semiconductor metrology, process characterization, and manufacturing process improvement.
  • •Experience developing and maintaining process controls, identifying excursions, and implementing changes.
  • •Strong knowledge of Design of Experiments (DOE) principles for process optimization.
Experience:4+ years
Education:Bachelor's
Skills:CommunicationCollaboration
Tech Stack:Semiconductor metrologyProcess characterizationManufacturing process improvementProcess controlsExcursion preventionDesign of Experiments (DOE)Statistical methodologies

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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