Failure Analysis Engineer - Power & Thermal

AMD
United States
Workplace: OnsiteFull timeFunction: Energy & Utilities OperationsEducation: bachelorsSkills: ["Communication","Documentation","Collaboration","Presentation","Problem-solving"]

Hands-on Failure Analysis Engineer focused on Power and Thermal for AMD GPU accelerators. Leads PCB triage and board-level fault isolation for power- and thermal-related issues; reviews schematics, sets up scope measurements, and designs functional tests to reproduce and isolate failures. Collaborates with design, validation, firmware and manufacturing to accelerate root-cause analysis and corrective actions, directly impacting quality and customer satisfaction.

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FursaFursa
AMD
AMD
3 months ago

Failure Analysis Engineer - Power & Thermal

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Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Hands-on Failure Analysis Engineer focused on Power and Thermal for AMD GPU accelerators. Leads PCB triage and board-level fault isolation for power- and thermal-related issues; reviews schematics, sets up scope measurements, and designs functional tests to reproduce and isolate failures. Collaborates with design, validation, firmware and manufacturing to accelerate root-cause analysis and corrective actions, directly impacting quality and customer satisfaction.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Energy & Utilities Operations

Key Responsibilities

  • •Support internal and external requests to troubleshoot AMD GPU product failures with primary focus on Power and Thermal failure analysis, PCB triage, and board-level failure isolation for continuous yield, quality, and customer support improvements.
  • •Develop and execute diagnostics, scope-based measurements, and functional test DOE’s to reproduce, characterize, and isolate difficult board-, power-, and thermal-related failures.
  • •Develop Automation and tools to run tests and analyze results/logs.
  • •Perform structured PCB triage by narrowing failures to the board, component, power rail, layout interaction, or system integration level, and work with the contract manufacturer and internal AMD teams to reproduce failures, isolate root cause, and determine the most effective next steps for debug and corrective action.
  • •Analyze liquid-cooling performance and thermal dissipation behavior, including flow-related conditions, heat transfer effectiveness, and cooling-path anomalies, to support efficient root cause analysis of Power and Thermal failures.

Key Requirements

  • •Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field.
  • •Deep expertise in hardware debug fundamentals, Power and Thermal failure analysis, diagnostics, and structured failure reproduction.
  • •Hands-on experience with lab equipment (oscilloscopes, logic analyzers, power analyzers) and debugging across Windows and Linux.
  • •Strong ability to review schematics/layouts, perform PCB triage, and develop targeted validation plans.
  • •Experience with liquid-cooling fundamentals and thermal transfer behavior in high-power systems.
Experience:GPUData centerAI/ML
Education:Bachelor's
Skills:CommunicationDocumentationCollaborationPresentationProblem-solving
Languages:English
Tech Stack:PythonWindowsLinuxOscilloscopeLogic analyzerPower analyzerSchematicsPCBDOELiquid coolingGPUData centerFirmware

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
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