Module Development Engineer

Intel
United States
Workplace: OnsiteFull timeUSD 99,030 - 139,810 annuallyFunction: Product ManagementEducation: bachelorsSkills: ["Engineering judgment","Problem-solving","Stakeholder management","Technical and analytical skills","Research and testing"]

Own collateral design and development for microelectronic packaging, covering thermal, mechanical, and electrical requirements. Define package performance specifications, execute qualification planning and data collection, and conduct tests and research on materials. Partner with Quality Assurance and Purchasing on material specs and vendor performance, troubleshoot packaging issues, and develop problem solutions using engineering judgment.

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Intel
Intel
1 day ago

Module Development Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Own collateral design and development for microelectronic packaging, covering thermal, mechanical, and electrical requirements. Define package performance specifications, execute qualification planning and data collection, and conduct tests and research on materials. Partner with Quality Assurance and Purchasing on material specs and vendor performance, troubleshoot packaging issues, and develop problem solutions using engineering judgment.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Mid level

Key Responsibilities

  • •Design, analyze, and develop packaging collaterals across thermal, mechanical, and electrical domains.
  • •Define package performance specifications and support technology certification through qualification plans and data collection.
  • •Conduct tests and research on basic materials and properties to inform design and qualification.
  • •Set material specifications for contract assemblers and coordinate with Quality Assurance and Purchasing on material quality and vendor performance.
  • •Consult on packaging problems and improvements, respond to customer/client requests, and develop solutions using engineering judgment.

Pay and Benefits

Salary: USD 99,030 - 139,810 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Bachelor's degree in mechanical engineering or a related STEM field and 6+ months of experience.
  • •Experience with mechanical design and tools such as CAD, SolidWorks, DriveWorks, and analysis methods like RSS/geometric dimensioning/finite element analysis.
  • •3+ years of experience with material handling systems (e.g., pick-n-place, motion control, vision systems) is preferred.
  • •Knowledge of material science and engineering fundamentals to create novel design solutions for high-volume manufacturing processes is preferred.
  • •Experience with stakeholder management, semiconductor devices/packaging processes, and technical/analytical problem-solving (including statistical design of experiments) is preferred.
Experience:Semiconductors
Education:Bachelor's in Mechanical engineering or related STEM field
Skills:Engineering judgmentProblem-solvingStakeholder managementTechnical and analytical skillsResearch and testing
Tech Stack:CADSolidWorksDriveWorksRSS analysisGeometric DimensioningFinite Element AnalysisPick-n-placeMotion controlVision systemsStatistical design of experimentsSemiconductor packaging

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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