Plasma Etch System Engineering Director

Applied Materials
United States
Workplace: OnsiteFull timeUSD 196,000 - 269,500 annuallyFunction: Executive & General ManagementExperience: 8+ yearsEducation: bachelorsSkills: ["Leadership","Problem-solving","Root cause analysis","Strategic thinking","Stakeholder management"]

Lead and manage plasma etch system engineering programs for next-generation semiconductor manufacturing equipment. Own end-to-end project design, development, and implementation across mechanical, electrical, physics, control systems, and materials compatibility. Create long-range engineering strategies, define performance metrics, and drive etch system NPI productivity and HVM readiness. Partner cross-functionally with product marketing, process/application, engineering, manufacturing, and customer field teams while interfacing with internal and external stakeholders.

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FursaFursa
Applied Materials
Applied Materials
1 month ago

Plasma Etch System Engineering Director

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Job Summary

Lead and manage plasma etch system engineering programs for next-generation semiconductor manufacturing equipment. Own end-to-end project design, development, and implementation across mechanical, electrical, physics, control systems, and materials compatibility. Create long-range engineering strategies, define performance metrics, and drive etch system NPI productivity and HVM readiness. Partner cross-functionally with product marketing, process/application, engineering, manufacturing, and customer field teams while interfacing with internal and external stakeholders.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Executive & General Management
Seniority: Director level

Key Responsibilities

  • •Leads, manages, and executes plasma etch system projects with cross-domain inputs including mechanical, electrical, physics, control systems, and materials compatibility.
  • •Owns complete engineering program design, development, and implementation aligned to project budgets and release schedules.
  • •Develops long-range engineering plans and strategies by reviewing engineering specifications and anticipating future needs.
  • •Provides guidelines and leadership to engineering teams for long-term program, strategy, and process design.
  • •Leads NPI productivity enablement and HVM readiness; defines performance metrics and reports progress against goals.
Travel: High travel

Pay and Benefits

Salary: USD 196,000 - 269,500 annually

Key Requirements

  • •8-12+ years of etch system experience in the semiconductor equipment industry.
  • •Broad, comprehensive understanding of plasma etch systems, theories, practices, and process/applications.
  • •BS in ME, EE, ChemE, Mat Sci, or related area; advanced degree preferred.
  • •Proven leadership and ability to execute segment/functional business plans and contribute to strategy development.
  • •Ability to resolve highly complex or unusual technical and business problems using advanced analytical judgment and root-cause problem solving.
Experience:8+ yearsSemiconductor equipmentSemiconductor manufacturing
Education:Bachelor's in ME, EE, ChemE, Mat Sci, or related area
Skills:LeadershipProblem-solvingRoot cause analysisStrategic thinkingStakeholder management
Tech Stack:Plasma etch systemsEtch chemistriesControl systemsChemical Vapor DepositionNPI productivityHVM readiness

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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