ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 2+ yearsEducation: bachelorsSkills: ["Strong analytical thinking","Logical reasoning","Critical thinking","Communication","Collaboration","Growth mindset"]

Support the Package Development Engineering team for advanced packaging in Singapore by transitioning new High Bandwidth Memory (HBM) product development into high-volume manufacturing. You’ll integrate AI-enabled tools into day-to-day work, apply engineering and statistical methods (DOE/SPC) to accelerate learning cycles, and partner with development, manufacturing, and suppliers. Own risk assessments (FMEA) and control plans, and enable smooth technology transfer for Low Volume Manufacturing and Run at Risk activities.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
2 weeks ago

ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live
Reposted: similar role first listed 6 months ago

Job Summary

Support the Package Development Engineering team for advanced packaging in Singapore by transitioning new High Bandwidth Memory (HBM) product development into high-volume manufacturing. You’ll integrate AI-enabled tools into day-to-day work, apply engineering and statistical methods (DOE/SPC) to accelerate learning cycles, and partner with development, manufacturing, and suppliers. Own risk assessments (FMEA) and control plans, and enable smooth technology transfer for Low Volume Manufacturing and Run at Risk activities.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community

Key Responsibilities

  • •Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, and effectiveness.
  • •Apply engineering and statistical methods to accelerate learning cycles from Design of Experiments (DOE) through product qualifications.
  • •Partner with Advanced Package Technology Development (APTD) and manufacturing teams to support Low Volume Manufacturing (LVM) and Run at Risk (RAR).
  • •Perform risk assessments using Failure Mode & Effect Analysis (FMEA) and implement control plans and corrective actions for abnormal conditions.
  • •Enable smooth technology transfer from development to high-volume manufacturing.

Key Requirements

  • •Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or a related discipline.
  • •At least 2 years of experience in a semiconductor-related field.
  • •Experience with fan-in packaging process / advanced packaging technology.
  • •Experience using SPC, DOE, and JMP, including shift and weekend coverage.
  • •Strong analytical, logical, and critical thinking skills with the ability to communicate and collaborate effectively across levels.
Experience:2+ yearsSemiconductorAdvanced packaging
Education:Bachelor's in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or related
Skills:Strong analytical thinkingLogical reasoningCritical thinkingCommunicationCollaborationGrowth mindset
Tech Stack:AI-enabled toolsJMPPythonMESDesign of Experiments (DOE)SPCFMEA

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn