Director – Package Materials Integration, APTD

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Executive & General ManagementExperience: 15+ yearsEducation: mastersSkills: ["Structured problem solving","Communication","People leadership","Cross-functional leadership","Technical leadership"]

Lead the strategy and execution for Micron’s advanced packaging materials roadmap for next-generation 3D memory products, including HBM and 3DS DRAM. Direct a global team across the U.S. and Asia while partnering with process development, equipment development, manufacturing, global quality, and purchasing. Own materials-package interaction problem solving, supplier engagement, and characterization strategies to translate insights into program and product decisions.

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Micron Technology
Micron Technology
2 months ago

Director – Package Materials Integration, APTD

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Job Summary

Lead the strategy and execution for Micron’s advanced packaging materials roadmap for next-generation 3D memory products, including HBM and 3DS DRAM. Direct a global team across the U.S. and Asia while partnering with process development, equipment development, manufacturing, global quality, and purchasing. Own materials-package interaction problem solving, supplier engagement, and characterization strategies to translate insights into program and product decisions.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Executive & General Management
Seniority: Director level

Key Responsibilities

  • •Lead the advanced packaging materials roadmap and ensure alignment with product roadmap timelines across multiple development programs.
  • •Provide organizational leadership for a diverse materials portfolio spanning chemistries, photoresists, films, polymer composites, and carrier materials.
  • •Drive supplier engagement at executive and engineering levels to prototype, develop, and certify materials for program needs.
  • •Build and lead a high-performing global team with direct reports in the U.S. and Asia, setting priorities and execution disciplines.
  • •Lead materials characterization strategies and translate findings into development and product decisions to resolve critical materials-package interaction issues.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid Time-offPaid HolidaysParental Leave

Key Requirements

  • •Master of Science/PhD in chemistry, chemical engineering, or materials science and engineering (PhD preferred).
  • •15+ years of relevant semiconductor manufacturing experience, including hands-on advanced packaging.
  • •10+ years of management/leadership experience in packaging technology development, leading global teams and execution across regions.
  • •Strong understanding of semiconductor process integration and process development with program/organizational leadership across cross-functional technical teams.
  • •Proven materials and characterization expertise, including materials-package interaction knowledge and experience with advanced memory packaging (plus).
Experience:15+ yearsSemiconductor manufacturingAdvanced packagingAdvanced memory packagingHeterogeneous integration
Education:Master's in chemistry, chemical engineering, or materials science and engineering
Skills:Structured problem solvingCommunicationPeople leadershipCross-functional leadershipTechnical leadership
Tech Stack:WLFOSoICCoWoSWoWInFO2.5D/3D heterogeneous integrationMaterials characterizationThermal testingMechanical testingElectrical testingMaterials-package interactionSimulation

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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