MTS Design Engineer, Bonding and Packaging

Micron Technology
Boise, Idaho, United States
Workplace: OnsiteFull timeFunction: Design (Product/UX/UI/Visual)Experience: 15-20 yearsEducation: mastersSkills: ["Cross-functional collaboration","Innovation","Data-driven decision making","Technical problem-solving","Stakeholder communication"]

Design next-generation semiconductor packaging for the Advanced Packaging Technology Development team, focusing on bonding and packaging technologies such as HBM, wafer-to-wafer, chip-on-wafer, flip chip, and TSV. Drive electrical, thermal, and thermo-mechanical design and characterization using multiphysics simulation, thermal improvement roadmaps, and CPI/2.5D-3D sensitivity studies. Partner with vendors and labs to implement testing and integrate AI/ML workflows to accelerate simulations and data-driven technology decisions.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
5 days ago

MTS Design Engineer, Bonding and Packaging

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 10 hours agoStatus: Live

Job Summary

Design next-generation semiconductor packaging for the Advanced Packaging Technology Development team, focusing on bonding and packaging technologies such as HBM, wafer-to-wafer, chip-on-wafer, flip chip, and TSV. Drive electrical, thermal, and thermo-mechanical design and characterization using multiphysics simulation, thermal improvement roadmaps, and CPI/2.5D-3D sensitivity studies. Partner with vendors and labs to implement testing and integrate AI/ML workflows to accelerate simulations and data-driven technology decisions.
Location: Boise, Idaho, United States
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)

Key Responsibilities

  • •Maintain deep expertise in semiconductor and advanced electronics packaging technologies including HBM, W2W, COW, flip chip, and TSV.
  • •Advance designs by modeling electrical parasitics, insertion loss, and impedance mismatches across materials, geometries, and operating conditions.
  • •Propose short- and long-term thermal improvement solutions and initiate projects aligned to thermal roadmaps.
  • •Apply chip-package interaction (CPI) understanding in 2.5D/3D systems; run sensitivity studies and propose justified design rules.
  • •Work with vendors and testing labs to design testing procedures and integrate AI-enabled workflows for packaging evaluations and heterogeneous integration.

Pay and Benefits

Perks:Health InsurancePaid LeaveLearning BudgetEquityWellness Stipend

Key Requirements

  • •MS or Ph.D. in Electrical Engineering, Material Science, Applied Physics, or a related field.
  • •15–20 years of professional experience with at least 10 years in electrical, thermal, and mechanical package analysis, modeling, and validation in semiconductors.
  • •Solid understanding of how design and process impact thermal performance and total thermal impedance across layers.
  • •Proficiency with engineering tools for Design of Experiments (DOE) and statistical analysis (e.g., JMP).
  • •Demonstrated ability to integrate AI/ML and generative AI tools into engineering workflows and technical assessments.
Experience:15-20 yearsSemiconductor industryAdvanced electronics packagingAI/MLGenerative AI
Education:Master's
Skills:Cross-functional collaborationInnovationData-driven decision makingTechnical problem-solvingStakeholder communication
Tech Stack:AIMachine learningGenerative AIPredictive analyticsDesign of Experiments (DOE)JMPMATLABExcelCadenceMultiphysics simulationSignal integrity

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn