Package Development Engineering – Product Integration Engineer (PDE PIE)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: bachelorsSkills: ["Ownership mindset","Analytical thinking","Critical thinking","Effective communication","Continuous improvement"]

Own product integration for semiconductor packaging from NPI phase gate through end-of-life. Drive new product introduction milestones, coordinate startup to reach first pass qualification, and support first silicon and engineering samples against cycle-time expectations. Monitor yield and quality deviation trends, lead electrical/physical failure analysis closures, and partner with process, equipment, and reliability owners across manufacturing sites and transfer efforts.

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Micron Technology
Micron Technology
3 months ago

Package Development Engineering – Product Integration Engineer (PDE PIE)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 14 hours agoStatus: Live

Job Summary

Own product integration for semiconductor packaging from NPI phase gate through end-of-life. Drive new product introduction milestones, coordinate startup to reach first pass qualification, and support first silicon and engineering samples against cycle-time expectations. Monitor yield and quality deviation trends, lead electrical/physical failure analysis closures, and partner with process, equipment, and reliability owners across manufacturing sites and transfer efforts.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Entry level

Key Responsibilities

  • •Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, and effectiveness.
  • •Drive New Product Introduction through NPI Phase Gate Review and coordinate new product startup to achieve first pass qualification.
  • •Support first silicon, engineering samples, and qual samples by meeting engineering hot lots cycle time expectations per PDT schedule.
  • •Monitor product yield trends and Quality Deviation Record (QDR) and reliability; initiate early attention if necessary.
  • •Lead Electrical Failure Analysis (EFA) and Physical Failure Analysis (PFA) closure for NPI issues and act as the technical integrator across multiple manufacturing sites and partners.

Key Requirements

  • •Bachelor’s degree in Mechanical, Materials, Aerospace, Chemical, Electrical, Process, Semiconductor, or related engineering.
  • •Fresh graduate with a strong passion for semiconductor engineering is encouraged to apply.
  • •Strong understanding of advanced package assembly flows, including die stacking, thin substrates, mold compound, warpage, and mechanical reliability.
  • •Hands-on experience with yield analysis, statistical data interpretation, failure analysis methodologies, process characterization, and validation.
  • •Familiarity with NPI qualification frameworks (Qual, Low Volume Manufacturing, Post Release Qualification) and Phase Gate/NPI/Technology Development processes.
Experience:Semiconductor
Education:Bachelor's in Mechanical, Materials, Aerospace, Chemical, Electrical, Process, Semiconductor or related Engineering discipline
Skills:Ownership mindsetAnalytical thinkingCritical thinkingEffective communicationContinuous improvement
Tech Stack:AI-enabled tools

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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