Senior Engineer/ Engineer – Package Silicon Integration Engineer

Micron Technology
Hyderabad
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringEducation: phdSkills: ["Analytical thinking","Problem-solving","Cross-functional collaboration","Communication","Data-driven decision making"]

Own the technical integration of new silicon and package technologies for memory applications, including resolving CPI issues and guiding progress through maturity phases. Develop virtual prototyping and multi-physics simulation workflows to assess CPI risk and inform test vehicle scope, then correlate results with characterization and reliability data. Plan DOEs, document BKMs, define design rules, and partner across R&D, wafer fabs, and manufacturing to improve yield, quality, and manufacturability.

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FursaFursa
Micron Technology
Micron Technology
1 week ago

Senior Engineer/ Engineer – Package Silicon Integration Engineer

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Last checked: 3 hours agoStatus: Live

Job Summary

Own the technical integration of new silicon and package technologies for memory applications, including resolving CPI issues and guiding progress through maturity phases. Develop virtual prototyping and multi-physics simulation workflows to assess CPI risk and inform test vehicle scope, then correlate results with characterization and reliability data. Plan DOEs, document BKMs, define design rules, and partner across R&D, wafer fabs, and manufacturing to improve yield, quality, and manufacturability.
Location: Hyderabad
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Integrate new silicon technologies with new package platforms for memory applications, focusing on identifying and resolving CPI issues.
  • •Build and apply virtual prototyping and AI workflows to evaluate materials, structures, and integration schemes before committing to physical builds.
  • •Plan and execute mechanical characterization strategies and DOEs to validate integration approaches across technology nodes.
  • •Develop and translate design rules, BKMs, and manufacturing-ready guidelines from characterization and simulation insights.
  • •Collaborate with R&D, wafer fabs, and manufacturing packaging teams to resolve integration challenges, support root cause analysis, and improve yield and manufacturability.

Key Requirements

  • •Understanding of IC package development with exposure to CPI concepts, test vehicle development, front-end fab processes, or BEOL integration.
  • •Ability to define and execute test vehicle strategies to characterize integration behaviors and accelerate technology maturity.
  • •Familiarity with virtual prototyping concepts and using simulation to reduce dependency on physical builds.
  • •Familiarity with at least one simulation/modeling domain such as mechanical stress/thermo-mechanical (FEA), thermal simulation, or electrical/signal & power integrity modeling.
  • •Translate test vehicle and simulation data into DOE decisions and design rules, with cross-functional coordination across global teams.
Experience:SemiconductorsIC packagingSimulationAI/MLMemoryDRAMNANDHBM
Education:PhD / Doctorate in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or Microelectronics
Skills:Analytical thinkingProblem-solvingCross-functional collaborationCommunicationData-driven decision making
Languages:English
Tech Stack:CPIIC package developmentVirtual prototypingMulti-physics simulationFEAThermal simulationElectrical modelingSignal integrityPower integrity modelingDesign of Experiments (DOEs)Root cause analysis3DSHBMBEOLFront-end fab

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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