Front End Central Product Integration (FE cPIE) MTS (FE)

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 7+ yearsEducation: bachelorsSkills: ["Logical thinking","Model-based problem solving","Data-driven decision making","Troubleshooting","Organizational skills","Flexibility","Initiative","Interpersonal skills","Teamwork","Communication"]

Lead process integration for FE cPIE modules, owning end-to-end integration strategies to close structural uniformity and cross-loop gaps. Drive physics- and process-based solutions with cross-module partners and suppliers to hit yield, quality, and reliability targets. Use model-based root-cause analysis and define inline monitoring/defense lines to maintain robust control. Standardize and scale BKMs globally while improving cycle time and development productivity through process re-engineering.

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Micron Technology
Micron Technology
3 months ago

Front End Central Product Integration (FE cPIE) MTS (FE)

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Job Summary

Lead process integration for FE cPIE modules, owning end-to-end integration strategies to close structural uniformity and cross-loop gaps. Drive physics- and process-based solutions with cross-module partners and suppliers to hit yield, quality, and reliability targets. Use model-based root-cause analysis and define inline monitoring/defense lines to maintain robust control. Standardize and scale BKMs globally while improving cycle time and development productivity through process re-engineering.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Lead structural uniformity and cross-loop product integration for critical FE cPIE modules, owning end-to-end integration strategies.
  • •Collaborate with cross-module process owners, PI subject-matter experts, and key suppliers to optimize integration structures and achieve yield, quality, and reliability targets.
  • •Develop and apply model-based root cause analysis frameworks to diagnose structural non-uniformity.
  • •Define, implement, and continuously strengthen critical inline monitoring and defense lines to ensure robust control of structural uniformity.
  • •Drive node-over-node shift-left integration and lead worldwide technical alignment by standardizing and scaling global network BKMs; identify performance/cycle-time gaps and re-engineer business processes to improve development productivity.

Key Requirements

  • •7+ years of relevant semiconductor process industry experience with knowledge of semiconductor fabrication process flows and how changes affect yield, device performance, and reliability.
  • •Understanding of DRAM and NAND operation and structure to interpret parametric, probe, and qualification data across front-end and backend assembly processes.
  • •Strong model-based problem solving and data-driven decision making, with good presentation skills.
  • •Proven ability to troubleshoot structure and device-related issues and drive root-cause solutions.
  • •Bachelors/Masters/PhD in EE, Materials Engineering, Materials Science, Physics, or Chemical; alternatively, more than 10 years’ experience in a process-related semiconductor role.
  • •Good organizational capabilities, flexibility, initiative, and strong interpersonal/teamwork skills.
  • •Good multi-tasking and verbal/written communication skills.
  • •Ability to travel to Micron sites as necessary for face-to-face collaboration.
Experience:7+ yearsSemiconductor fabricationDRAMNAND
Education:Bachelor's in EE, Materials Engineering, Materials Science, Physics and Chemical
Skills:Logical thinkingModel-based problem solvingData-driven decision makingTroubleshootingOrganizational skillsFlexibilityInitiativeInterpersonal skillsTeamworkCommunication
Tech Stack:Semiconductor Fabrication process flowsDRAMNANDPhysics-based integrationModel-based root cause analysisInline monitoringBIC yield targets

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
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