Texas Instruments

4 months ago

Device Modeling Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 13 hours agoStatus: Live

Job Summary

Join TI’s SPICE Modeling Group to extract and optimize compact (SPICE) models for next-generation semiconductor devices. You’ll partner with analog, digital, and mixed-signal design teams, develop new model formulations, and automate modeling infrastructure to speed technology development. The role also includes building AI/ML-enhanced models and parameter extraction methods, and validating model accuracy through measurement and analysis, directly supporting automotive, industrial, and embedded products.

Location: Bengaluru

Workplace: Onsite

Employment Type: Full time

Job Function: Research & Scientific (R&D)

Seniority: Mid level

Key Responsibilities

•Extract compact models for advanced semiconductor device types (e.g., MOS, LDMOS, DEMOS, BJT, passives, GaN, RF, sensors, NVM, RAM).
•Partner with designers and technologists to deploy modeling solutions for breakthrough circuit topologies.
•Develop innovative model formulations for emerging device technologies.
•Automate modeling infrastructure to accelerate technology development.
•Develop and validate AI/ML-enhanced models and parameter extraction methodologies, including measurement and analysis.

Key Requirements

•Ph.D. in Electrical Engineering (or related field).
•5+ years in compact (SPICE) modeling and semiconductor technology.
•Expert-level experience with compact device models (BSIM, MEXTRAM, HICUM, MVSG-GAN, ASM) and parameter extraction tools (ICCAP, BSIMPROPLUS, MBP).
•Proficiency with EDA tools (Cadence), SPICE simulators (Spectre), and Verilog-A.
•Deep understanding of semiconductor physics and circuit analysis.

Experience:5+ yearsSemiconductorsDevice physicsEDASPICE modeling

Education:PhD / Doctorate in Electrical Engineering

Skills:PlanningCross-functional communicationLeading technical discussionsCollaborationProject status communication

Tech Stack:SPICECompact modelsMOSLDMOSDEMO SBJTPassivesGaNRFSensorsNVMRAMBSIMMEXTRAMHICUMMVSG-GANASMICCAPBSIMPROPLUSMBP

Company Brief

Texas Instruments

Designs and manufactures semiconductors and analog chips used in industrial, automotive, personal electronics, communications, and enterprise systems. It is one of the world’s largest semiconductor companies, with a broad portfolio of embedded processing and power products.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Dallas, United States

Founded: 1930

Website LinkedIn

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Texas Instruments

4 months ago

Device Modeling Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 13 hours agoStatus: Live

Job Summary

Location: Bengaluru

Workplace: Onsite

Employment Type: Full time

Job Function: Research & Scientific (R&D)

Seniority: Mid level

Key Responsibilities

•Extract compact models for advanced semiconductor device types (e.g., MOS, LDMOS, DEMOS, BJT, passives, GaN, RF, sensors, NVM, RAM).
•Partner with designers and technologists to deploy modeling solutions for breakthrough circuit topologies.
•Develop innovative model formulations for emerging device technologies.
•Automate modeling infrastructure to accelerate technology development.
•Develop and validate AI/ML-enhanced models and parameter extraction methodologies, including measurement and analysis.

Key Requirements

•Ph.D. in Electrical Engineering (or related field).
•5+ years in compact (SPICE) modeling and semiconductor technology.
•Expert-level experience with compact device models (BSIM, MEXTRAM, HICUM, MVSG-GAN, ASM) and parameter extraction tools (ICCAP, BSIMPROPLUS, MBP).
•Proficiency with EDA tools (Cadence), SPICE simulators (Spectre), and Verilog-A.
•Deep understanding of semiconductor physics and circuit analysis.

Experience:5+ yearsSemiconductorsDevice physicsEDASPICE modeling

Education:PhD / Doctorate in Electrical Engineering

Skills:PlanningCross-functional communicationLeading technical discussionsCollaborationProject status communication

Tech Stack:SPICECompact modelsMOSLDMOSDEMO SBJTPassivesGaNRFSensorsNVMRAMBSIMMEXTRAMHICUMMVSG-GANASMICCAPBSIMPROPLUSMBP

Company Brief

Texas Instruments

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Dallas, United States

Founded: 1930

Website LinkedIn