Dry Etch Process Develop Engineer
New York
Workplace: OnsiteFull timeUSD 107,000 - 182,000 annuallyFunction: Communications, PR & CommunityExperience: 3+ yearsEducation: mastersSkills: ["Collaboration","Communication","Root-cause analysis","Data analysis","Documentation"]Build, integrate, and optimize plasma dry etch processes for next-generation memory devices. Own process development and qualification, improving CD control, profile/anisotropy, selectivity, uniformity, and defect performance using metrology, DOEs, SPC, and statistical analysis. Collaborate across integration, lithography, thin films, CMP, device, and manufacturing teams to mature R&D results into high-volume manufacturing, including root-cause analysis and vendor partnership on chamber matching and hardware recipes.
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