Dry Etch Process Develop Engineer

Micron Technology
New York
Workplace: OnsiteFull timeUSD 107,000 - 182,000 annuallyFunction: Communications, PR & CommunityExperience: 3+ yearsEducation: mastersSkills: ["Collaboration","Communication","Root-cause analysis","Data analysis","Documentation"]

Build, integrate, and optimize plasma dry etch processes for next-generation memory devices. Own process development and qualification, improving CD control, profile/anisotropy, selectivity, uniformity, and defect performance using metrology, DOEs, SPC, and statistical analysis. Collaborate across integration, lithography, thin films, CMP, device, and manufacturing teams to mature R&D results into high-volume manufacturing, including root-cause analysis and vendor partnership on chamber matching and hardware recipes.

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FursaFursa
Micron Technology
Micron Technology
2 weeks ago

Dry Etch Process Develop Engineer

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Job Summary

Build, integrate, and optimize plasma dry etch processes for next-generation memory devices. Own process development and qualification, improving CD control, profile/anisotropy, selectivity, uniformity, and defect performance using metrology, DOEs, SPC, and statistical analysis. Collaborate across integration, lithography, thin films, CMP, device, and manufacturing teams to mature R&D results into high-volume manufacturing, including root-cause analysis and vendor partnership on chamber matching and hardware recipes.
Location: New York
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop, qualify, and sustain dry etch (plasma) unit processes for sophisticated memory technologies.
  • •Optimize critical process metrics such as CD control, etch profile/anisotropy, selectivity, microloading, uniformity, and line edge/line width roughness.
  • •Drive defect reduction and yield improvement using inline/out-of-line metrology, DOEs, SPC, and statistical data analysis.
  • •Perform root-cause analysis and implement corrective actions for process excursions, tool health issues, and integration-related failures.
  • •Document process baselines and change controls, communicate results, and support technology transition into large-scale production.

Pay and Benefits

Salary: USD 107,000 - 182,000 annually
Perks:Health InsuranceDentalVisionPaid LeavePaid HolidaysParental Leave

Key Requirements

  • •M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related field relevant to plasma processing and semiconductor manufacturing.
  • •B.S. with 3+ years of semiconductor processing experience, with emphasis on dry etch/plasma etch.
  • •Experience in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis.
  • •Working knowledge of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity).
  • •Ability to collaborate across multi-functional technical teams and communicate results clearly; AI proficiency is a plus.
Experience:3+ yearsSemiconductorsSemiconductor processingProcess developmentManufacturingR&D
Education:Master's
Skills:CollaborationCommunicationRoot-cause analysisData analysisDocumentation
Tech Stack:Plasma etchDry etchMetrologyDOESPCStatistical data analysisICP/RIEChamber matchingEUV photolithographyThin filmsCMPLine edge/line width roughnessDefect characterizationTool health monitoring

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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