College Intern - Process and Digitalization

HP
Singapore
Workplace: OnsiteInternshipFunction: Communications, PR & CommunityEducation: mastersSkills: ["Communication","Teamwork","Willingness to learn","Ability to work independently","Practical thinking"]

Collaborate with engineering and operations teams to build smart factory solutions for high-volume semiconductor manufacturing. Work on concurrent projects spanning production, sustainability, and new product introduction, using AI, IIoT, and smart-vision/automation technologies. Gain hands-on experience with precision semiconductor packaging tools and help define and improve manufacturing processes through structured studies. Build solutions that future-proof manufacturing quality of supplies.

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FursaFursa
HP
HP
21 hours ago

College Intern - Process and Digitalization

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Source: Company careers pageValidated by: Fursa AI
Last checked: 21 hours agoStatus: Live

Job Summary

Collaborate with engineering and operations teams to build smart factory solutions for high-volume semiconductor manufacturing. Work on concurrent projects spanning production, sustainability, and new product introduction, using AI, IIoT, and smart-vision/automation technologies. Gain hands-on experience with precision semiconductor packaging tools and help define and improve manufacturing processes through structured studies. Build solutions that future-proof manufacturing quality of supplies.
Location: Singapore
Workplace: Onsite
Employment Type: Internship
Job Function: Communications, PR & Community
Seniority: Intern level

Key Responsibilities

  • •Collaborate with engineering to develop solutions for manufacturing operations using AI, IIoT, smart vision systems, and automation solutions.
  • •Perform practical work on high-speed/high-precision semiconductor die attach, wire bonding, chip attach, and over-mold tooling in high-volume manufacturing environments.
  • •Participate in concurrent projects across production, sustainability, and new product introduction.
  • •Work with engineering and operations executives to build smart factory solutions that future-proof manufacturing quality.
  • •Innovate and define improved manufacturing processes using methodical studies and approaches.

Key Requirements

  • •Master’s or Bachelor’s degree in Mechanical, Manufacturing, Automation, Computer Engineering, Data Science/Analytics/AI, or a related field.
  • •Commit to a 5–6 months full-time internship starting in January 2027.
  • •Willingness to learn and ability to communicate ideas clearly in a team.
  • •Strong team and individual working skills.
  • •Applied skills with Power BI, Power Automate and/or Robotic Process Automation are an advantage; good knowledge of AI, IIoT, digitalization, and machine learning is a plus.
Experience:Semiconductor packagingManufacturingSmart factoryAIIIoT
Education:Master's in Mechanical, Manufacturing, Automation, Computer Engineering, Data Science/Analytics/AI
Skills:CommunicationTeamworkWillingness to learnAbility to work independentlyPractical thinking
Tech Stack:AIIIoTSmart vision systemPower BIPower AutomateRobotic Process AutomationMachine LearningDigitalizationSoftware programming

Company Brief

HP
Designs and manufactures personal computers, printers, and related supplies, as well as provides software, services, and solutions for consumers and enterprises worldwide.
Industry: Hardware Devices
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Palo Alto, United States
Founded: 1939
Glassdoor
Glassdoor: 3.8
WebsiteLinkedIn