Broadcom

1 week ago

Principal/Master Engineer – Silicon Photonics Advanced Packaging

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Lead packaging and assembly development to scale a silicon photonics platform, using advanced 2.5D/3D packaging to connect design with volume manufacturing. Serve as the primary technical lead for packaging design and process development, collaborating with PIC/IC, opto-mechanical, and assembly teams. Manage OSAT/CM partners for wafer- and chip-scale processes, establish DFM rules, and drive NPI through yield optimization and production ramp.

Location: San Jose

Workplace: Onsite

Employment Type: Full time

Job Function: Communications, PR & Community

Seniority: Mid level

Key Responsibilities

•Lead advanced packaging design, substrate definition, and assembly process development activities.
•Collaborate with PIC/IC and opto-mechanical teams to align package architectures with electrical, optical, and thermal requirements.
•Manage OSAT/CM partners for wafer and chip-scale assembly development; define and enforce packaging specifications and design rules.
•Troubleshoot assembly issues, implement risk-mitigation for critical assembly nodes, and optimize yield for NPI-to-volume production.
•Evaluate and deploy next-generation 2.5D/3D packaging technologies and support data-driven DFM decisions across teams.

Pay and Benefits

Salary: USD 167,500 - 268,000 annually

Equity and Bonus:Equity

Perks:Health InsuranceDentalVision401kEquityEapPaid Leave

Key Requirements

•MS or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Optical Physics, or a related engineering discipline.
•15+ years of hands-on experience in semiconductor advanced packaging, opto-mechanical design, silicon photonics assembly, or manufacturing operations.
•Deep understanding of wafer, chip, and board-level assembly processes, especially 2.5D/3D integration techniques for photonics.
•Proven history developing high-yield optical products, with preference for silicon photonics-based platforms.
•Demonstrated operational experience managing OSATs/CMs, including setting process control windows, troubleshooting line excursions, and directing yield engineering.

Experience:15+ yearsSemiconductor advanced packagingSilicon photonicsManufacturing operations

Education:Master's in Mechanical Engineering, Materials Science, Electrical Engineering, Optical Physics

Skills:Technical leadershipCross-functional collaborationProblem-solvingIndependent thinkingDecisive technical leadership

Tech Stack:Silicon photonics2.5D packaging3D packagingWafer-scale packagingChip-scale packagingOpto-mechanical designDesign for Manufacturing (DFM)New Product Introduction (NPI)Yield engineeringOSATCMWafer assemblyChip assemblyBoard-level assemblyProcess control windows

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn

Loading job details...

Preparing the role view and application actions.

Broadcom

1 week ago

Principal/Master Engineer – Silicon Photonics Advanced Packaging

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 6 hours agoStatus: Live

Job Summary

Location: San Jose

Workplace: Onsite

Employment Type: Full time

Job Function: Communications, PR & Community

Seniority: Mid level

Key Responsibilities

•Lead advanced packaging design, substrate definition, and assembly process development activities.
•Collaborate with PIC/IC and opto-mechanical teams to align package architectures with electrical, optical, and thermal requirements.
•Manage OSAT/CM partners for wafer and chip-scale assembly development; define and enforce packaging specifications and design rules.
•Troubleshoot assembly issues, implement risk-mitigation for critical assembly nodes, and optimize yield for NPI-to-volume production.
•Evaluate and deploy next-generation 2.5D/3D packaging technologies and support data-driven DFM decisions across teams.

Pay and Benefits

Salary: USD 167,500 - 268,000 annually

Equity and Bonus:Equity

Perks:Health InsuranceDentalVision401kEquityEapPaid Leave

Key Requirements

•MS or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Optical Physics, or a related engineering discipline.
•15+ years of hands-on experience in semiconductor advanced packaging, opto-mechanical design, silicon photonics assembly, or manufacturing operations.
•Deep understanding of wafer, chip, and board-level assembly processes, especially 2.5D/3D integration techniques for photonics.
•Proven history developing high-yield optical products, with preference for silicon photonics-based platforms.
•Demonstrated operational experience managing OSATs/CMs, including setting process control windows, troubleshooting line excursions, and directing yield engineering.

Experience:15+ yearsSemiconductor advanced packagingSilicon photonicsManufacturing operations

Education:Master's in Mechanical Engineering, Materials Science, Electrical Engineering, Optical Physics

Skills:Technical leadershipCross-functional collaborationProblem-solvingIndependent thinkingDecisive technical leadership

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn