Senior Packaging Technical Engineer - Hardware
Bengaluru
Workplace: HybridFull timeFunction: Solutions Engineering & Sales EngineeringExperience: 8+ yearsEducation: bachelorsSkills: ["Communication","Problem-solving"]Define and drive key packaging design elements such as the chip pad ring, substrate interconnect scheme, and package layout. Collaborate with circuit, signal integrity, RTL, place-and-route, substrate layout, and system design teams to establish chip floor plans, pad rings, substrates, and ball-out. Bring strong expertise in board/system design and electrical package performance, communicating across teams to solve complex technical problems.

