3D IC and ADVANCED PACKAGING CAD ENGINEER

AMD
Markham
Workplace: HybridFull timeCAD 105,600 - 158,400 annuallyFunction: Software EngineeringSkills: ["Verilog","RTL","UPF","Python","TCL","Perl","Scripting","Automation","Multi-clock design","Low power design"]

Lead 3D-IC design and advanced packaging CAD flows from RTL through signoff, integrating AI capabilities into CAD workflows. Collaborate with global design teams and EDA vendors to push QoR improvements, using Synopsys/Cadence toolchains, ML-driven optimization, and scripting to automate multi-step design and verification tasks.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
AMD
AMD
3 months ago

3D IC and ADVANCED PACKAGING CAD ENGINEER

âś“ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 1 hour agoStatus: Live

Job Summary

Lead 3D-IC design and advanced packaging CAD flows from RTL through signoff, integrating AI capabilities into CAD workflows. Collaborate with global design teams and EDA vendors to push QoR improvements, using Synopsys/Cadence toolchains, ML-driven optimization, and scripting to automate multi-step design and verification tasks.
Location: Markham
Workplace: Hybrid
Employment Type: Full time
Job Function: Software Engineering

Key Responsibilities

  • •Implement and maintain 3D-IC and advanced packaging design flows from RTL through signoff.
  • •Develop and integrate end-to-end AI capabilities into CAD flows—including ML-based optimization, predictive modeling, and LLM-assisted automation.
  • •Build and deploy agentic AI systems that automate multi-step design and verification tasks.
  • •Partner with EDA vendors (Synopsys, Cadence) on 3D-IC feature requirements, best practices, and AI co-development opportunities.
  • •Define strategy and initiatives to ensure flows meet future design requirements and advanced technology nodes.

Pay and Benefits

Salary: CAD 105,600 - 158,400 annually

Key Requirements

  • •Bachelor's or Master’s degree in computer engineering or Electrical Engineering
  • •Strong experience in 3D-IC design and advanced packaging technologies
  • •Hands-on experience with Synopsys 3D-IC Compiler and related EDA toolchains
  • •Hands-on scripting experience with Python, TCL, and Perl in a Linux/Unix environment
  • •Demonstrated experience applying AI to CAD/EDA problems
Experience:3D-ICEDAAI in CAD
Education:
Skills:VerilogRTLUPFPythonTCLPerlScriptingAutomationMulti-clock designLow power design
Languages:English
Tech Stack:Synopsys3D-IC CompilerEDA toolsPythonTCLPerlVerilogRTLUPFLinux

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
Glassdoor
Glassdoor: 3.9
WebsiteLinkedIn