3D IC and ADVANCED PACKAGING CAD ENGINEER
AMD
Markham
Workplace: HybridFull timeCAD 105,600 - 158,400 annuallyFunction: Software EngineeringSkills: ["Verilog","RTL","UPF","Python","TCL","Perl","Scripting","Automation","Multi-clock design","Low power design"]Lead 3D-IC design and advanced packaging CAD flows from RTL through signoff, integrating AI capabilities into CAD workflows. Collaborate with global design teams and EDA vendors to push QoR improvements, using Synopsys/Cadence toolchains, ML-driven optimization, and scripting to automate multi-step design and verification tasks.
