R&D Engineer: Test Engineering Wafer Test, Final Module Test & Characterization

Develop and validate wafer-, die-, and module-level test capabilities for optoelectronic transceivers, sensors, and in-house mixed-signal ASICs. Define test requirements, build and debug test hardware and software, design test PCBs and probe cards, and hand over solutions to production. Perform full device characterization across corner cases, analyze results, and collaborate with IC-designers, product-designers and project leaders to optimize cost-efficient test packages.