Package Pathfinding Architect, MTS

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Hardware, Embedded & Systems EngineeringExperience: 5+ yearsEducation: mastersSkills: ["Strong analytical and problem-solving skills","Data-driven mindset","Effective communication","Detail-oriented","Continuous improvement"]

Define next-generation packaging pathfinding and system architectures for complex memory systems, optimizing for speed, bandwidth, power, capacity, and thermal/mechanical/electrical performance. Lead cross-stack co-optimization across silicon, package, board, and system, guiding long-term memory technology packaging strategy and influencing standards. Serve as a technical interface to internal teams and customers while developing AI-based EDA and automation tools to accelerate design cycles.

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FursaFursa
Micron Technology
Micron Technology
1 week ago

Package Pathfinding Architect, MTS

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Last checked: 18 hours agoStatus: Live

Job Summary

Define next-generation packaging pathfinding and system architectures for complex memory systems, optimizing for speed, bandwidth, power, capacity, and thermal/mechanical/electrical performance. Lead cross-stack co-optimization across silicon, package, board, and system, guiding long-term memory technology packaging strategy and influencing standards. Serve as a technical interface to internal teams and customers while developing AI-based EDA and automation tools to accelerate design cycles.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Hardware, Embedded & Systems Engineering
Seniority: Mid level

Key Responsibilities

  • •Define next-generation package pathfinding and system architectures optimized for speed, bandwidth, power, capacity, and thermal/mechanical/electrical performance.
  • •Lead cross-stack co-optimization across silicon, package, board, and system using a package-centric approach.
  • •Drive long-term memory technology packaging strategy and influence industry standards.
  • •Partner with silicon/system design teams and customers to develop next-gen solutions for edge-AI and datacenter memory products.
  • •Develop AI-based EDA and internal automation tools to enhance design-cycle efficiency, including measurement automation for incoming substrate materials.

Key Requirements

  • •Master’s degree (or equivalent) in EE/CE/CS or related field, plus industry experience.
  • •At least 5 years of relevant industry experience in package design, electrical simulations, and tools like Ansys, Siemens, and Cadence.
  • •Hands-on experience in memory systems packaging design including signaling/IO design and PDN design.
  • •Strong understanding of memory timing, signaling, and package process technology with EDA tools for design, analysis, and simulation.
  • •Experience applying AI or LLMs to improve engineering efficiency.
Experience:5+ yearsMemory systemsElectronic packagingEDASemiconductors
Education:Master's
Skills:Strong analytical and problem-solving skillsData-driven mindsetEffective communicationDetail-orientedContinuous improvement
Tech Stack:AnsysSiemensCadenceEDAJMPPythonMATLABAILLMsElectrical simulationsSignal integrityPower integrityThermo-mechanical analysisThermal analysis

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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