Staff Engineer, Product Integration Lead, HIG High Bandwidth Memory

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Administration & Executive AssistanceExperience: 8+ yearsEducation: mastersSkills: ["Collaboration","Communication","Interpersonal skills","Presentation skills","Problem-solving"]

Lead product integration of Micron HBM products into end-system requirements within the HIG HBM Product Development Team. Own HBM development swimlane requirements using the Success Criteria Document (SCD), align silicon-to-system commitments, and collaborate across HBM architecture, product and systems engineering, business units, packaging, and quality. Drive issue triage, risk assessment, sample-capability alignment, and manage qualification definition changes through the Change Control Board to meet system specs and schedules.

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FursaFursa
Micron Technology
Micron Technology
3 weeks ago

Staff Engineer, Product Integration Lead, HIG High Bandwidth Memory

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Source: Company careers pageValidated by: Fursa AI
Last checked: 6 hours agoStatus: Live

Job Summary

Lead product integration of Micron HBM products into end-system requirements within the HIG HBM Product Development Team. Own HBM development swimlane requirements using the Success Criteria Document (SCD), align silicon-to-system commitments, and collaborate across HBM architecture, product and systems engineering, business units, packaging, and quality. Drive issue triage, risk assessment, sample-capability alignment, and manage qualification definition changes through the Change Control Board to meet system specs and schedules.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance
Seniority: Mid level

Key Responsibilities

  • •Manage technical inputs and drive silicon-system alignment on requirements and commitments using the Success Criteria Document (SCD).
  • •Collaborate with HBM Architecture, Product and Systems Engineering, Business Unit, Technology Development, Packaging, and Global Quality teams to close gaps between HBM commitments and system requirements.
  • •Understand sample usage and capability gaps, managing HBM sample delivery in sync with system development timelines.
  • •Assist with risk assessment and lead triage for system or chip feature interactions, coordinating mitigations with stakeholders.
  • •Manage qualification definition and changes, driving the Change Control Board for late/post qualification changes while communicating priorities to maintain system-spec focus.

Key Requirements

  • •Bachelor’s or Master’s degree in Electrical or Computer Engineering.
  • •8+ years demonstrating ability in Product, Design, Yield Enhancement, or related engineering fields.
  • •Lead technical issues to closure with creative, effective solutions in a highly collaborative environment.
  • •Desire to develop knowledge of overall HBM to system development.
  • •Knowledge of DRAM/HBM device/design and system management is beneficial.
Experience:8+ yearsProduct developmentYield enhancementHBMDRAMSystems engineering
Education:Master's in Electrical or Computer Engineering
Skills:CollaborationCommunicationInterpersonal skillsPresentation skillsProblem-solving
Tech Stack:HBMHigh Bandwidth MemoryDRAMSilicon-system alignmentSuccess Criteria Document (SCD)Change Control BoardAI-enabled enhancements

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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