Wafer Fab Process Engineer

Broadcom
Singapore
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 5+ yearsEducation: bachelorsSkills: ["Analytical thinking","Problem-solving","Communication","Leadership"]

Lead semiconductor wafer process development, optimization, and transfer to manufacturing to meet yield, quality, cost, and reliability targets. Own advanced process modules across thin film deposition, wafer thinning, and thermal steps; drive yield improvement and defect reduction using SPC and DOE; support NPI and process transfers; and perform root-cause analysis with corrective and preventive actions.

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FursaFursa
Broadcom
Broadcom
1 month ago

Wafer Fab Process Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 20 days agoStatus: Live

Job Summary

Lead semiconductor wafer process development, optimization, and transfer to manufacturing to meet yield, quality, cost, and reliability targets. Own advanced process modules across thin film deposition, wafer thinning, and thermal steps; drive yield improvement and defect reduction using SPC and DOE; support NPI and process transfers; and perform root-cause analysis with corrective and preventive actions.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Own and drive advanced process modules (thin film deposition, wafer thinning, thermal steps like oxidation/diffusion/implantation).
  • •Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
  • •Drive new process integration (NPI) and process transfer to high-volume manufacturing.
  • •Perform root cause analysis and implement corrective/preventive actions.
  • •Define process control plans, SPC strategies, and OCAP execution, collaborating cross-functionally and mentoring junior team members.

Key Requirements

  • •Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).
  • •At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation).
  • •Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
  • •Demonstrated leadership in cross-functional technical projects.
  • •Strong analytical, problem-solving, and communication skills.
Experience:5+ yearsSemiconductorWafer fabricationProcess developmentThin filmThermal processing
Education:Bachelor's in Engineering (Electrical, Chemical, Materials, or related)
Skills:Analytical thinkingProblem-solvingCommunicationLeadership
Certifications:Six Sigma (Green/Black Belt)
Tech Stack:Thin film depositionMetal/passivationWafer thinningOxidationDiffusionImplantationSPCDOEFMEAStatistical data analysis toolsOCAPNPISix Sigma

Company Brief

Broadcom
Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Irvine, United States
Founded: 1991
WebsiteLinkedIn