Broadcom

1 day ago

Wafer Fab Process Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 7 hours agoStatus: Live

Job Summary

Lead semiconductor wafer process development, optimization, and transfer to manufacturing to meet yield, quality, cost, and reliability targets. Own advanced process modules across thin film deposition, wafer thinning, and thermal steps; drive yield improvement and defect reduction using SPC and DOE; support NPI and process transfers; and perform root-cause analysis with corrective and preventive actions.

Location: Singapore

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Mid level

Key Responsibilities

•Own and drive advanced process modules (thin film deposition, wafer thinning, thermal steps like oxidation/diffusion/implantation).
•Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
•Drive new process integration (NPI) and process transfer to high-volume manufacturing.
•Perform root cause analysis and implement corrective/preventive actions.
•Define process control plans, SPC strategies, and OCAP execution, collaborating cross-functionally and mentoring junior team members.

Key Requirements

•Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).
•At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation).
•Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
•Demonstrated leadership in cross-functional technical projects.
•Strong analytical, problem-solving, and communication skills.

Experience:5+ yearsSemiconductorWafer fabricationProcess developmentThin filmThermal processing

Education:Bachelor's in Engineering (Electrical, Chemical, Materials, or related)

Skills:Analytical thinkingProblem-solvingCommunicationLeadership

Certifications:Six Sigma (Green/Black Belt)

Tech Stack:Thin film depositionMetal/passivationWafer thinningOxidationDiffusionImplantationSPCDOEFMEAStatistical data analysis toolsOCAPNPISix Sigma

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn

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Broadcom

1 day ago

Wafer Fab Process Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 7 hours agoStatus: Live

Job Summary

Location: Singapore

Workplace: Onsite

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Seniority: Mid level

Key Responsibilities

•Own and drive advanced process modules (thin film deposition, wafer thinning, thermal steps like oxidation/diffusion/implantation).
•Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
•Drive new process integration (NPI) and process transfer to high-volume manufacturing.
•Perform root cause analysis and implement corrective/preventive actions.
•Define process control plans, SPC strategies, and OCAP execution, collaborating cross-functionally and mentoring junior team members.

Key Requirements

•Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).
•At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation).
•Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.
•Demonstrated leadership in cross-functional technical projects.
•Strong analytical, problem-solving, and communication skills.

Experience:5+ yearsSemiconductorWafer fabricationProcess developmentThin filmThermal processing

Education:Bachelor's in Engineering (Electrical, Chemical, Materials, or related)

Skills:Analytical thinkingProblem-solvingCommunicationLeadership

Certifications:Six Sigma (Green/Black Belt)

Tech Stack:Thin film depositionMetal/passivationWafer thinningOxidationDiffusionImplantationSPCDOEFMEAStatistical data analysis toolsOCAPNPISix Sigma

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn