HBM EQUIPMENT ENGINEER(FY28 NCG)

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Design (Product/UX/UI/Visual)Skills: ["Root cause analysis","Data analysis","Troubleshooting","Supplier risk management","Process validation"]

Leverage AI-enabled methods and Microsoft Copilot to improve semiconductor assembly equipment utilization, yield performance, alarm code analysis, parts lifetime prediction, and manufacturing efficiency. Use AI-driven analytics to identify performance gaps, predict failures, optimize preventive maintenance, and reduce unplanned downtime. Apply AI-assisted troubleshooting for root cause analysis, support process/material evaluations, validate NPI deployments, and drive smart manufacturing initiatives while supporting audits and supplier quality risk mitigation.

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FursaFursa
Micron Technology
Micron Technology
3 days ago

HBM EQUIPMENT ENGINEER(FY28 NCG)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 1 hour agoStatus: Live

Job Summary

Leverage AI-enabled methods and Microsoft Copilot to improve semiconductor assembly equipment utilization, yield performance, alarm code analysis, parts lifetime prediction, and manufacturing efficiency. Use AI-driven analytics to identify performance gaps, predict failures, optimize preventive maintenance, and reduce unplanned downtime. Apply AI-assisted troubleshooting for root cause analysis, support process/material evaluations, validate NPI deployments, and drive smart manufacturing initiatives while supporting audits and supplier quality risk mitigation.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)
Seniority: Mid level

Key Responsibilities

  • •Leverage AI-enabled and AI-assisted work methods, including Microsoft Copilot and Generative AI, to improve equipment utilization and yield performance.
  • •Use AI-powered analytics to predict equipment failures, optimize preventive maintenance, and reduce unplanned downtime.
  • •Apply AI-assisted troubleshooting to accelerate root cause analysis of equipment alarms, process excursions, and yield loss mechanisms.
  • •Coordinate process, equipment, and material evaluations and validate/qualify new processes, equipment, materials, and manufacturing technologies for NPI deployment.
  • •Support FDC/RMS/APC/SPC systems, drive smart manufacturing initiatives, manage supplier quality risk mitigation, and support internal/external audits while maintaining compliance.

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendEquityHealth Insurance

Key Requirements

  • •Minimum 5 years of semiconductor equipment engineering experience.
  • •Familiarity with TCB/DB process.
  • •Ability to identify, diagnose, and resolve assembly equipment issues using data-driven and AI-supported methodologies.
  • •Experience coordinating process, equipment, and material evaluations to optimize manufacturing performance and quality.
  • •Experience supporting preventive maintenance and unplanned downtime reduction using AI-powered analysis.
Experience:Semiconductor equipment engineering
Skills:Root cause analysisData analysisTroubleshootingSupplier risk managementProcess validation
Tech Stack:Microsoft CopilotGenerative AIAdvanced analyticsTCB/DBFDCRMSAPCSPCNPIAI-powered data analysis

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
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