ENGINEER - F15 MFG CMP Equipment Engineer
Japan
Workplace: OnsiteFull timeFunction: Design (Product/UX/UI/Visual)Skills: ["Problem-solving","Communication","Technical communication","Time management","Multitasking"]Lead CMP/BOND process tooling setup and improvement for semiconductor manufacturing, including establishing process conditions/parameters, upgrading process capability, and reducing production costs. Drive design, development, and performance characterization of new equipment, identifying and closing hardware/procedure gaps. Oversee installation and upgrades while managing quality, cost, and schedule. Partner with equipment vendors to improve existing products and maintain documentation for performance, operation, maintenance, and cost metrics, including audit support.
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