AMD

1 week ago

Packaging Engineer

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Last checked: 1 hour agoStatus: Live

Job Summary

Own manufacturing readiness and sustainment for advanced semiconductor packaging (InFO, EFB/CoWoS variants, WLFO, FCBGA, LGA, and chiplets). Partner closely with oSATs and cross-functional teams to drive packaging yield, quality, cost, and operational productivity improvements, standardize assembly process baselines, and lead continuous improvement. Manage supplier performance, execute change management, and provide timely program status reporting across the packaging lifecycle.

Location: Taiwan

Workplace: Hybrid

Employment Type: Full time

Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

•Bring up and sustain manufacturing readiness for InFO, EFB/CoWoS-L, CoWoS-S, WLFO, FCBGA, LGA, and chiplet packages at the manufacturing site.
•Improve packaging yield, quality, cost, and operational productivity, and drive sustaining activities.
•Drive assembly process baseline standardization and continuous improvement.
•Manage packaging interaction activities across assembly, bump, 3D IC, HBM, wafer fab/sort, functional test, and mark/pack.
•Drive supplier performance and strategic supplier management; execute change management and coordinate NPI and ramp-up readiness while reporting program status.

Pay and Benefits

Salary: TWD 1,691,060 - 2,415,800 annually

Key Requirements

•Experience in InFO or 2.5D/3D bump/TSV/packaging, including Flip Chip BGA/LGA or WLFO process engineering, with at least 7 years of assembly work experience.
•Strong knowledge of InFO and chiplet packaging, including 2.5D/3D TSV/packaging and chip-packaging interaction.
•Experience managing performance at assembly manufacturing site/suppliers, including yield and quality improvement and handling outliers.
•Familiarity with DOE and JMP.
•Bachelor’s or Master’s degree in Mechanical, Material, or Chemical Engineering.

Experience:7+ yearsSemiconductor engineering

Education:Master's in Mechanical or Material or Chemical Engineering

Skills:Team playerCross-functional communicationProject managementAnalytical skillsRoot cause resolution

Languages:English

Tech Stack:DOEJMP

Company Brief

AMD

Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1969

Glassdoor: 3.9

Website LinkedIn

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AMD