Senior/Staff Equipment Development Engineer (APTD)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringEducation: phdSkills: ["Collaboration","Problem-solving","Continuous improvement","Leadership","Data-driven decision-making"]

Develop and optimize advanced wafer-level packaging and stacking equipment in Micron’s APTD team, focusing on first-of-a-kind (FAOK) technology to improve capability, productivity, and cost. Lead equipment maturity and availability improvements, evaluate new equipment/materials, and establish long-term hardware roadmaps for post-probe wafer and die processing. Use failure analysis, FMEA, 8D, and data/AI-enabled methods to diagnose root causes and drive continuous improvements with partner teams.

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FursaFursa
Micron Technology
Micron Technology
1 week ago

Senior/Staff Equipment Development Engineer (APTD)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 11 hours agoStatus: Live

Job Summary

Develop and optimize advanced wafer-level packaging and stacking equipment in Micron’s APTD team, focusing on first-of-a-kind (FAOK) technology to improve capability, productivity, and cost. Lead equipment maturity and availability improvements, evaluate new equipment/materials, and establish long-term hardware roadmaps for post-probe wafer and die processing. Use failure analysis, FMEA, 8D, and data/AI-enabled methods to diagnose root causes and drive continuous improvements with partner teams.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking.
  • •Improve equipment capability and enable process improvements to reduce costs and enhance productivity.
  • •Establish and improve equipment management projects to deliver tech node requirements; evaluate and promote new equipment and materials.
  • •Build hardware strategic roadmaps for 5+ years in post probe wafer and die processing and develop wafer/assembly equipment meeting Micron product requirements.
  • •Use failure analysis and data/AI-enabled methods to identify improvement opportunities, including defense coverage through process/measurement/inspection/testing and correlating defense mechanisms.

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendEquityHealth InsuranceRecognition

Key Requirements

  • •BS/MS/PhD (or equivalent) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or a related technical field.
  • •5+ years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control, and packaging stacking equipment (e.g., TC bonder/Hybrid Bonder).
  • •Proficiency in Python, R, and/or SQL for statistical analysis, process modeling, and data analytics; strong capabilities to support SPC, DOE, defect analysis, and dashboarding.
  • •Familiarity with E3 FDC and RMS (Recipe Management System) for equipment and process control.
  • •Demonstrated problem-solving ability with a consistent track record to resolve issues and address root causes.
Experience:SemiconductorWafer fabEquipment developmentAdvanced packaging
Education:PhD / Doctorate in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
Skills:CollaborationProblem-solvingContinuous improvementLeadershipData-driven decision-making
Tech Stack:PythonRSQLVisual BasicMESETOAutoshellE3 FDCRMSSPCDOEFMEA8DFDCSMAIAIAI-assisted toolsSMAI teamFMEA/8D

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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