Packaging Module Development Engineer

Intel
Malaysia
Workplace: OnsiteFull timeFunction: Product ManagementSkills: ["Influencing","Written communication","Verbal communication","Data analysis","Problem-solving","Proactive","Working under pressure"]

Develop and qualify electronic packaging assembly processes for new product and test vehicles, including die/DRAM attach, component attach, solder ball attach, and deflux. Apply process development expertise (DOE, SPC, FMEA) to optimize quality, reliability, cost, yield, productivity, and manufacturability. Conduct experiments to characterize materials and failure modes, document improvements via technical white papers, and partner with cross-functional teams to ramp technologies to high-volume manufacturing in factories.

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Intel
Intel
1 day ago

Packaging Module Development Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 1 hour agoStatus: Live
Reposted: similar role first listed 6 months ago

Job Summary

Develop and qualify electronic packaging assembly processes for new product and test vehicles, including die/DRAM attach, component attach, solder ball attach, and deflux. Apply process development expertise (DOE, SPC, FMEA) to optimize quality, reliability, cost, yield, productivity, and manufacturability. Conduct experiments to characterize materials and failure modes, document improvements via technical white papers, and partner with cross-functional teams to ramp technologies to high-volume manufacturing in factories.
Location: Malaysia
Workplace: Onsite
Employment Type: Full time
Job Function: Product Management
Seniority: Mid level

Key Responsibilities

  • •Develop, qualify, and ramp materials and processes for electronic packaging assembly (die/DRAM attach, component attach, solder ball attach, deflux).
  • •Optimize manufacturing efficiency and improve quality, reliability, cost, yield, productivity, and manufacturability requirements.
  • •Conduct fundamental studies and experiments to characterize materials, processes, and identify potential failure modes.
  • •Develop process specifications using DOE and data analysis, and document improvements through white papers.
  • •Collaborate cross-functionally to build material technologies on test vehicles and products and assess performance.

Key Requirements

  • •BEng/MEng/MSc/PhD in a relevant engineering discipline (Mechanical, Materials, Chemical, Electrical, Physics, Mechatronics).
  • •Research & Development background is preferred (especially MSc/PhD).
  • •Experience in electronic packaging development, with preferred experience in Chip Attach, Deflux, or Ball Attach processes.
  • •Strong data analysis, problem-solving, and the ability to use DOE and statistical methods to improve processes.
  • •Excellent influencing and written/verbal communication skills, with the ability to work under tight timelines and pressure.
Experience:Electronic packagingResearch and developmentManufacturingProcess development
Education:
Skills:InfluencingWritten communicationVerbal communicationData analysisProblem-solvingProactiveWorking under pressure
Tech Stack:Design of Experiments (DOE)Statistical Process Control (SPC)Failure Modes/Effects Analysis (FMEA)

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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Glassdoor: 3.8
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